ENSSEL

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Enssel, Inc., founded in October 2007, provides smart factory solutions in MES, QMS, YMS, EES, Equipment Interface and Artificial Intelligence, and related service for managing business processes and data analysis to customers in all sectors to increase competitive innovation for semiconductor and high technology customers which include global top semiconductor companies and medium size companies.

MES : Manufacturing Execution System

QMS : Quality Management System

YMS : Yield Management System

EEQ : Equipment Engineering System

We also import and support several lines of semiconductor fabrication equipment for semiconductor manufacturers. Enssel provides German InnoLas company’s Wafer Marking System, USA CHA company’s metal evaporators and sputters, USA Microsanj company’s thermal analysis metrology tools and related service to Korean global top semiconductor makers, medium size semiconductor and display companies as exclusive agency in Korea.

E+H사 MX204-8-21-V

8인치 wafer의 Thickness, warp등의 Measurement... More Info Less Info







Manually Loaded Wafer Geometry Gauge for thin 150 mm and 200 mm Silicon Wafers.

Application
Control of Thickness and Shape of Wafers after Backside Grinding

Description
The MX 204-8-21-V is a manually loaded, semi-automatic wafer geometry measuring instrument for thin 150 mm and 200 mm silicon wafers. This equipment is dedicated to  control  the  thickness  and  shape  of  backside  ground  wafers  with  or  without protective tape.
Like on all other E+H wafer geometry instruments, E+H's technology of contactless capacitive distance sensors is applied.
The throughput of the equipment is 80 wafers / hour or better.



E+H사 MX301

Wafer내 한 포인트의 Thickness Measurement... More Info Less Info







Features : 

Can  be  adapted  to different thickness ranges within a few seconds Default setting 100 –  900 µm
          Dynamic range 800 µm

          Wafer diameter range 2" to 200 mm
          Simplest handling
          Accuracy ±0.5 µm
          Serial interface RS232

          Resolution 0.1 µm
          Five digit display, directly in µm

          No limitations in case of electrical resistance (NTD silicon)
          New easy calibration 


InnoLas IL C3000
300mm Wafer의 Laser Marking System... More Info Less Info



Wafersize: 300 mm (optional 200 mm)
•      Two cassette stations
•      Class 1 Mini Environment
•      OHT, AGV and PGV capable
•      Up to 120 (180) Wafer/hr


MicrosanJ NT220 Thermal 분석기

Nanosecond Transient Thermal Imagers... More Info Less Info







Key Features:

• Transient Resolution: 50 ns

• Absolute Temperature Measurement

• 365 nm to 1700 nm spectral range

• Spatial Resolution: <300 nm

• Dual Mode: TR + IR

• Pixel-by-pixel calibration


InnoLas IL3000
300mm Laser Marking System (200mm available)... More Info Less Info



The IL3000 is for one ready to use wafer marking system designed to process 300mm bare silicon and other semiconductor materials. 
The system includes four open cassette stations, a double arm robot and a process chamber suitable for deep marking processes on the wafers front side and optionally on the back side.
It can be equipped with a range of laser systems and additional options such as reading systems or a full SEMI- compliant SECS/GEM interface. 
It is capable of marking all common types of dot matrix fonts, for example single and double density OCR, barcode and 2-D matrix codes.

CHA사 SOLUTION System
R&D에 최적화된 E-Beam Evaporator system... More Info Less Info



Although from the exterior most small-scale PVD systems appear the same, it's what goes on inside the process chamber that can have the most impact on your application. Too often, low-cost systems come with marginal features and few capabilities. Until now.
Engineered to handle a wide range of deposition needs, the Solution incorporates many of the features that make our Mark 40 and Mark 50 industry standards. Like a fully water-cooled stainless steel chamber that allows lot users greater flexibility to optimize process start temperatures. Or space enough for even our largest volume electron-beam gun or resistance sources. There is even a choice in pumping packages including diffusion, cryo or turbo molecular pumps. 
Of course, a PVD system is only as good as its tooling. Which is precisely why Solution offers the widest range of available tooling in the industry. Lift-off, Planetary, Variable angle and much more. Choose from a variety of sources including Swing, Resistance and our full line of SmartSource® electron beam guns.