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TESCAN KOREA Ltd.

Seoul, 
Korea (South)
http://www.tescan.com
  • Booth: C866

TESCAN Korea Ltd has been established in 1998. We, TESCAN KOREA Ltd. are representing the products of SEM from TESCAN a.s. Coater from Quorum, and also EDS from IXRF system, Nanotest from Micro Material and responsible for after-sales & service in Korea.

 Products

  • TESCAN Solaris X
    A Plasma FIB-SEM platform for deep sectioning and the highest resolution end-pointing for package level failure analysis...

    • TESCAN SOLARIS X extends the capabilities of FIB physical failure analysis to large-area and deep cross-sectioning (up to 1 mm) of packaged microelectromechanical and optoelectronic devices, by combining the high-throughput i-FIB+™ Xe plasma FIB column with the next generation triple-objective Triglav™ electron column. 
    Xe plasma FIB milling enables large-volume bulk material removal without the drawbacks of the traditionally used methods, which are often time-consuming, broadly destructive, dependent on operator skill, and can induce new heat/mechanical artifacts. Ion implantation and interaction volume of Xe ions is significantly smaller than those of Ga ions. In addition, the inert nature of Xe ions prevents the formation of intermetallic compounds that can result in changes to the physical properties of the specimen and interfere with electrical measurements.
  • TESCAN Solaris
    A solution for semi-automated high-quality TEM lamella preparation...

    • TESCAN SOLARIS is a turnkey FIB-SEM solution for ultra-thin TEM lamella preparation in semiconductor failure analysis labs. TESCAN SOLARIS combines the most precise Ga focused ion beam with UHR-SEM immersion optics to ensure the best possible synergy between ion beam milling and ultra-high-resolution SEM imaging.
    TESCAN SOLARIS provides users with the capability to create high quality TEM lamella with minimal surface beam damage or milling artifacts, even from today`s most advanced semiconductor devices like 7nm FinFETs or 3D NANDs. Easily prepare not only standard (top-down) lamella, but also inverted, planar or double-cross lamella using our optimized in-situ lift-out geometries, workflows and specialized sample holders.
    The Orage™ Ga+ FIB column was designed to meet increasingly stringent TEM lamella preparation requirements. With its ultimate FIB resolution, broad range of beam current choices and excellent performance at low beam energies, the Orage™ FIB column enables fast sputtering rates for large-volume milling tasks, superior throughput and minimum time to complete analyses.

Categories

203 Equipment, Inspection & Measurement
  • Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr
    • 207 Equipment, Process
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment


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