• Booth: B237

Innovation in Rapid Thermal and CVD processing

With systems installed in 44 countries Annealsys is a leading manufacturer of Rapid Thermal Processing (RTP and RTCVD) and Direct Liquid Injection Deposition (CVD and ALD) systems. We are supplying number of companies for the manufacturing of MEMS, sensors, optoelectronics, telecommunication, power and discrete devices. Many famous laboratories worldwide are using our machines for the development of future semiconductor, photovoltaic and nanotechnologies components.

We are pushing the limits of rapid thermal annealing with cold wall chamber technology, high temperature (2000°C) and high vacuum capabilities, fast cooling solutions and pulse annealing mode for processing thermally sensitive substrates.

The Direct Liquid Injection deposition tools have been developed for deposition of metals, oxides and 2D materials. These systems use the widest range of organometallic chemicals like low vapor pressure and thermally unstable precursors.

Our philosophy involves building up a long-term relationship with our customers, providing high reliability and high quality tools, insuring low cost of ownership and offering outstanding customer support.


  • AS-Master RTP system
    The AS-Master is a 200 mm cold wall chamber RTP system with vacuum and high temperature capabilities. The system is available with manual loading for process development and with robot handling system for MEMS and small scale production applications....

  • The AS-Master system is 200 mm cold wall chamber Rapid Thermal Processor. The system can receive a susceptor with a maximum outer diameter of 240 mm for processing 200 mm wafers or batch of smaller wafers.

    The cold wall chamber technology provides significant advantages: high process reproducibility, higher cooling rate, accurate temperature measurement and contamination free environment.

    Several halogen lamp furnaces versions are available with a high temperature version that can perform processes up to 1450°C. The cold wall chamber technology associated with the pulse control mode of the lamp furnace allows processing thermally sensitive substrates.

    The fast cooling option increases the cooling rate by 4 times compare to conventional RTP systems.

    The system can be provided with customized loading systems including loading of the wafers on or into graphite susceptors for annealing of materials with low infrared absorption.

  • AS-Premium RTP system
    The AS-Premium is a RTP platform with a square chamber that can process silicon and compound semiconductor wafers up 150 mm. The versatile configuration allows different temperature ranges, different heating and loading configurations....

  • The AS-Premium is a 6-inch infrared lamp RTP system that has been designed to be versatile with different configurations to meet customer requirements

    The process chamber can be provided with top heating or top and bottom heating. The system can be used for R&D application with manual loading and can be provided for production application with cassette to cassette loading or a cluster tool.

    The high vacuum capability combined with a loadlock offers ultra-clean process conditions for processes that are very sensitive to oxygen or moisture contamination.

    The machine can be used for a wide range of applications including optoelectronics, MEMS, power components (SiC, GaN), silicon smoothening, etc.

  • MC-100 DLI-CVD / DLI-ALD system
    The MC-100 is a Direct Liquid Injection deposition system. It can perform CVD, ALD, pulse pressure CVD inside the same process chamber. Applications include epitaxy of oxide layers like LiNbO3....

  • The Annealsys MC-100 system is a 4-inch (100 mm) DLI-CVD / DLI-ALD reactor dedicated to complex oxides deposition.

    The association of the heating system with the direct liquid injection vaporization system makes this system unique for material research. It offers the capability to deposit most of the materials of the periodic table with multi process capability inside the same process chamber.

    The Direct Liquid Injection (DLI) vaporizers provide perfect control of precursor flow and allow utilization of low vapor pressure and diluted chemical precursors. The fast switching of the precursor vapor flows with the by-pass valve provide perfect interface control for deposition of nanolaminates.

    The automated liquid panel is optimized for reduced consumption of chemical precursors. The no dead volume design provides full rising capability for easy change of chemicals and refilling of the precursor tanks in a glove box.

    Applications: oxides, metals, nitrides, 2D materials (TMD), etc.

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