JEOL Korea Ltd.

Spot type Electron Beam Lithography System JBX-8100FS achieved high throughput, small footprint and electric power saving.

    Small footprint

The area required for the standard system is 4.9 m (W) x 3.7 m (D) x 2.6 m (H), much smaller than the conventional systems.

Low power consumption

Power needed for normal operation is approximately 3 kVA, reduced to 1/3 of the conventional systems.

High throughput

The system has two exposure modes, high resolution and high throughput modes, supporting different types of patterning   ultra fine processing to small to mid size production. It has minimized the idle time during exposure while increasing the maximum scanning speed by 1.25 to 2.5 times to 125 MHz (the world’s highest level) for high speed writing.

Version

The JBX-8100FS is available in 2 versions: G1 (entry model) and G2 (full option model). Optional accessories can be added to the G1 model as needed.

New Functions

An optional optical microscope is available to enable examination of patterns on the sample without exposing resist to light. A signal tower is provided as standard for visual monitoring of system operation.

Laser positioning resolution

Stage positions are measured and controlled in 0.6 nm steps as standard, and in 0.15 nm steps with an optional upgrade.

   System control

Versatile Linux® operating system combined with a new graphic user interface provides ease in operation. The data preparation program supports both Linux® and Windows®.

Notices:
 Windows is a registered trademark of Microsoft Corporation in the United States and other countries.
 Linux® is the registered trademark of Linus Torvalds in the U.S. and other countries.

Advances in the development of new materials featuring complex nanostructures places increased demands on FIB-SEM instruments for exceptional resolution, accuracy and throughput. In response, JEOL has developed the JIB-4700F Multi Beam System to be used in morphological observations, elemental and crystallographic analyses of a variety of specimens.

The JIB-4700F features a hybrid conical objective lens, GENTLEBEAM™ (GB) mode and an in-lens detector system to deliver a guaranteed resolution of 1.6nm at a low accelerating voltage of 1 kV. Using an "in-lens Schottky-emission electron gun" that produces an electron beam with a maximum probe-current of 300nA, this newly-developed instrument allows for high-resolution observations and fast analyses. For the FIB column, a high-current density Ga ion beam of up to 90nA maximum probe-current is employed for fast ion milling and processing of specimens.
 Concurrent with high-speed cross-section processing by FIB, high-resolution SEM observations and fast analyses can be conducted utilizing energy dispersive X-ray spectroscopy (EDS) and electron backscatter diffraction (EBSD). Additionally, a three-dimensional analysis function that automatically captures SEM images at certain intervals in cross-section processing is provided as one of the JIB-4700Fs standard features.

High resolution SEM observation

Guaranteed resolution of 1.6 nm at a low accelerating voltage of 1 kV is delivered by a magnetic/electrostatic hybrid conical objective lens, GB mode and in-lens detector.

Fast analysis

Fast analysis is enabled because high resolution can be maintained in analyses under large probe-current by the combination with an in-lens Schottky-emission electron gun and aperture angle control lens.

High speed processing

High-power Ga ion beam column enables rapid processing of specimens.

Enhanced detection system

Simultaneous detection system involving the newly-developed in-lens detectors allows for real-time observation of images   up to 4 detectors.

Versatility

The JIB-4700F is compatible with a variety of optional attachments including EDS, EBSD, cryo-transfer systems, cooling stages and air-isolated transfer systems, etc.

Three-dimensional observation/analysis

Three-dimensional visualization of images and analysis data is possible with the combination with high-resolution SEM and appropriate optional analysis unit(s).

Stage linkage function

Advances in the development of new materials featuring complex nanostructures places increased demands on FIB-SEM instruments for exceptional resolution, accuracy and throughput. In response, JEOL has developed the JIB-4700F Multi Beam System to be used in morphological observations, elemental and crystallographic analyses of a variety of specimens.

With the atmosphere pick-up system (optional) and stage linkage function, TEM (transmission electron microscope) specimens can be retracted with ease.

Picture overlay system

Overlaying an optical microscope image   the atmosphere pick-up system on FIB images makes it easier to identify a FIB processing point.

JEOL has developed a new TEM, JEM-ACE200F, which meets these requests. The JEM-ACE200F can work on the pre-programmed recipes, which reflects the standard analysis procedures of the device characterizations. With the recipes, the unattended operation of the microscope is available and data are produced automatically.

Product development background

Along with further miniaturization of devices in the recent semiconductor industry, the transmission electron microscope (TEM) has become an essential tool for various applications of device characterization. These applications include morphological observation, critical dimension measurement, elemental analysis, local strain analysis, and dopant concentration measurement. Particularly the industry requests fast, stable, and highly resolved data acquisition for the morphological observation, the critical dimension measurement and the elemental analysis, in order to feedback those to manufacturing process.

JEOL has developed a new TEM, JEM-ACE200F, which meets these requests. The JEM-ACE200F can work on the pre-programmed recipes, which reflects the standard analysis procedures of the device characterizations. With the recipes, the unattended operation of the microscope is available and data are produced automatically.

Since the JEM-ACE200F inherits hardware technologies of the JEM-ARM200F high-end TEM and the JEM-F200 multi-purpose FE-TEM, this new high throughput analytical electron microscope provides superbly high stability and analytical capabilities with a renewed sophisticated exterior design.

Main Features
?High throughput ?Fast data acquisition by a combined use with automatic microscope tuning functions (TEM/STEM).
?Short specimen-holder pre-evacuation period enables quick start of observation within 30 sec   the time of holder  ion.

?User-friendly interface ?Sophisticated GUI based on daily microscope operation.
?All of the operations can be covered by mouse operation.

?Recipes for easy programming and changing ?The recipe of workflow can be programmed with intuitively designed tools.
?The workflow can be flexibly programmed using a variety of standardized programming languages.

?Environmental-friendly design ?Adoption of a highly environmental resistance enclosure.
?Remote operation.

Main Specifications

TEM resolution (at 200 kV)
Point image 0.21 nm
Lattice image 0.10 nm
Information limit 0.11 nm 

STEM resolution (at 200 kV)
STEM DF image 0.136 nm
STEM BF image 0.136 nm 

Electron gun
Schottky field emission gun, ZrO/W(100) emitter 

Accelerating voltage
60 to 200 kV
(80, 200 kV; standard, Other voltages; option) 

Specimen movements
X, Y: ± 1.0 mm   Z: ± 0.2 mm 

Specimen tilt angle
TX/TY (with Specimen Tilting Holder)   ±20°／±25°
TX (with Specimen High Tilting Holder)   ±80° 

Options
Energy dispersive X-ray spectrometer (EDS), Electron energy-loss spectrometer (EELS), Multi-specimen auto transfer system, Integrated TEM control system (Automation Center), TEM/STEM tomography system 

Nano-patterning requires accurate and reproducible metrology. Since automated CD-SEMs are expensive and not flexible, manual SEM tools are used at most nano-fabrication centers. ProSEM enables automated feature size (CD) measurements   manually taken SEM images.
Meaningful process monitoring and process calibration tasks need many measurements   numerous SEM images. ProSEM Provides stable, consistent feature size measurements with an easy-to-use interface.  It removes the operator induced variation.
Measurements reported include: feature size at top or bottom, line edge roughness, line width roughness and spectral analysis. Shape analysis, side wall angle, CD uniformity and other measurements will be added.
1D and 2D image views show the edge finding results, visualizing the quality of the measurement.
Image processing coupled with advanced edge finding algorithms enable measurements under difficult conditions.
ProSEM will interface to the other GenISys products to support process analysis and calibration.

Capabilities include

■ Advanced algorithms

■ Convenient data handling

■ Analysis of lines, trenches, gratings, circular and square features.

■ Interfaces to other GenISys tools

JBX-9500FS is a 100kV EB system that provides world-top-level throughput and positional accuracy among Spot beam lithography systems. This EB system can accommodate up to 300mmΦ wafer and up to 6-inch mask, thus responding to R&D and production in various fields, such as nanoimprint, photonic device and communication device.

In addition to the maximum scan speed of 100MHz, JBX-9500FS achieves overlay accuracy of ±11nm, field stitching accuracy of ±10nm and positional accuracy within field of ±9nm when the field size is 1000μm×1000μm. Thus, JBX-9500FS is a 100kV EB system that provides world-top-level throughput and positional accuracy among Spot beam lithography systems.

Since JBX-9500FS employs Beam positioning DAC of 20bits and Scan DAC of 14bits, higher-resolution scan step of 0.25nm is obtained for writing data increment of 1nm, thus reproducing more precise writing data.

Its high scan speed up to 100MHz enables JBX-9500FS to maintain short scan steps at large-current writing, thus enhancing throughput even when high-precision pattern writing is required.

World-top-class positional accuracy is achieved by LBC (laser beam control) that provides the high-resolution, minimum beam positioning step of 0.15nm (λ/4096).

Furthermore, a unique auto calibration function (automatic correction function) developed by JEOL achieves highly reliable, stable pattern writing for a long period of time. Timing of auto correction can be set for each field or each pattern. This function is very effective for a long period writing without an operator, for example at weekends or consecutive holidays.

JBX-9500FS can accommodate up to 300mmΦ wafer and up to 6-inch mask, thus responding to R&D and production in various fields, such as nanoimprint, photonic device and communication device. Adding the material cassette transfer system (option) enables this EB system to load up to 10 cassettes.

The use of Fine Pitch Control Program (field size fine modulation program) enables JBX-9500FS to fabricate a chirped-period grating such as a DFB laser.

The JCM-7000 Benchtop Scanning Electron Microscope is designed based on a key concept of "Easy-to-use SEM with seamless navigation and live analysis". The JCM-7000 incorporates three innovative functions; "Zeromag" for smooth transition   optical to SEM imaging, "Live Analysis" for finding constituent elements for an image observation area, and "Live 3D" for displaying a reconstructed live 3D image during SEM observation.

When you place the JCM-7000 next to an optical microscope, further-faster and more-detailed foreign material analysis and quality control can be made.

The JCM-7000 Benchtop Scanning Electron Microscope is designed based on a key concept of "Easy-to-use SEM with seamless navigation and live analysis". The JCM-7000 incorporates three innovative functions; "Zeromag" for smooth transition   optical to SEM imaging, "Live Analysis" for finding constituent elements for an image observation area, and "Live 3D" for displaying a reconstructed live 3D image during SEM observation.

When you place the JCM-7000 next to an optical microscope, further-faster and more-detailed foreign material analysis and quality control can be made.