SCREEN SEMICONDUCTOR SOLUTIONS Co., Ltd.

Yongin-si, Gyeonggi-do, 
Korea (South)
http://www.screen.co.jp
  • Booth: D612


Advancing Global Technology & Innovation

As of 1st October, 2014, SCREEN Semiconductor Solutions Co., Ltd. succeeded the semiconductor equipment business of Dainippon Screen Mfg. Co., Ltd. and made a new start as a business company specializing in semiconductor production equipment.
At the beginning of this start, we formed Mission, Vision and 6 Core Values all workers of SE Group sharing here as a Corporate Philosophy.  
* Mission : Shape the Bright Future for Society and Employees as a Result of Our Contribution to the Customers
* Vision :To be a Company Recognized for Operational Excellence 
* 6 Core Values 
Customer-Oriented 
Commitment & Accountability 
Ownership
Quality 
Innovation 
Great place to work


 Products

  • SU-3300 Single Wafer Cleaning System
    Seventh Generation System Inherits SCREENs Single Wafer Cleaning DNA Industry-leading Processing Technologies Meet High-throughput 24 Chamber Design...

  • SCREEN Semiconductor Solutions developed the first rotating wafer cleaning system in 1983. Over the past 30 years, we have made it our mission to optimize processing at the air-liquid interface on the wafer and further refine critical cleaning technologies. Our new "SU-3300" seventh generation system inherits every aspect of this accumulated technical expertise and knowhow.
    The "SU-3300" can be expanded to include up to 24 chambers, giving it outstanding productivity. It also offers high processing efficiency and is equipped with cutting-edge functions that minimize variations between chambers. Together these features ensure extremely stable operation.
    As semiconductor production becomes increasingly demanding, SCREEN is right there with you, creating remarkable new solutions like the "SU-3300".
  • Spin Scrubber SS-3200
    Advanced Transport System Achieves High Throughput of up to 800 wafers per hour...

  • 1. High Throughput
    The development of an advanced transport system and a proprietary algorithm improves throughput by around two times compared to the conventional SS-3100.
    This delivers high throughput of up to 800 wafers per hour.

    2. Space-saving Design
    As with the SS-3100, the SS-3200 is equipped with up to 8 processing chamber units. High throughput can be attained without increasing the number of processing chamber units, providing a very similar footprint to the conventional system.

    3. Installation of the Latest Cleaning Tools Achieves High Cleaning Capacity
    The SS-3200 can be equipped with the outstanding cleaning tools developed for conventional systems.
    This includes the Nanospray? spray cleaning system, which provides damageless cleaning of fine patterns.
    These tools contribute significantly to the improvement of yield rates for next-generation semiconductor devices.

    4. Improved Cleaning Supporting Next generation Processes
    The SS-3200’s cleaning level is improved by the  ion of components specially designed for miniaturization and a new production method including comprehensive particle handling measures. This supports the increasingly strict cleaning requirements for next-generation cleaning processes.

  • Wet Station FC-3100
    Next-generation Versatility, Speed and Functionality...

  • 1. High Throughput
    The FC-3100 is capable of achieving a high throughput of 650 wafers per hour, which has been realized by incorporating a high throughput buffer module and a high-speed transfer module.

    2. Stable and Highly Reliable
    Seven independent modules can be easily configured to best suit your production needs. Each module is of standardized construction. Dual cleaning baths are built into a single compact module for smoother assembly, adjustment, testing and installation.

    3. Low Pressure Drying System (HiLPD)
    Provided with the HiLPD, a low pressure drying system, the FC-3100 is able to provide high concentration IPA vapor without using carrier N2 gas to greatly suppress watermark generation. In addition, the high concentration IPA vapor rapidly reduces surface tension preventing pattern collapse.

    4. Dry-Air Drying Tecnology(DAD)
    DAD is a new Dry Air Drying technology that blows dry air with an extremely low dew point over the wafers to instantly eliminate any moisture after cleaning. It maintains that same performance as conventional drying using IPA, but reduces the processing time by about half(*). It also enables running costs to be reduced to up to1/8 (*) of previous costs, and there is no resist dissolution. Of course, because IPA is not used at all, there are absolutely no VOC emissions. This new drying technology is therefore extremely safe and environment friendly.

  • Flash Lamp Annealer LA-3100
    Contributes Significantly to Improving the Characteristics of State-of-the-Art Devices...

  • 1. Controls heating temperature profiles by the millisecond
    The LA-3100 precisely controls the thermal dosage profile of several milliseconds   a xenon flash lamp, which heats instantly using flash of light.
    The wafer surface temperature can be lowered or raised at mid- to high speed, making heat processing with a low thermal budget a reality.
    This in turn allows for a high level of activation for the dopant injected into the source/drain, along with precise control of the concentration profile.

    2. Low oxygen atmosphere
    Single wafer processing makes it possible to anneal in a strictly-controlled low oxygen atmosphere.

    3. Functionality for measuring wafer temperature during heat irradiation
    The LA-3100 features new functionality for precisely controlling the heat treatment of the entire wafer surface in milliseconds, while measuring the wafer temperature during heat irradiation. This makes it easy to understand and solve physical phenomena with a focus on temperature control, starting with the R&D stage.

  • Single Wafer Cleaner SU-2000
    Inherits High-end Single Wafer Cleaning Technology to Deliver Outstanding Cost Performance...

  • In all areas of the electronics industry, technologies and products designed to reduce environmental impact, known as green devices, are receiving significant attention. Demand has expanded especially in power semiconductors manufacturing the inverter devices that efficiently control electricity, air conditioners, trains, and hybrid/electric vehicles. In addition, usage of micro electro mechanical systems (MEMS) and back side illumination (BSI) sensors in smartphones is increasing quickly and production of these devices is also receiving attention.
    In response to these market trends and requests   customers, Screen launched its Frontier project in 2010 to develop manufacturing equipment for the environmental device market. As its fourth successful Frontier project development, Screen is proud to present the SU-2000, a Single Wafer Cleaner ideally suited to green device production.

    1. Outstanding Cost Performance
    ● This system inherits the basic design concept and performance of the high-end SU-3200 and is equipped with advanced processing capabilities.

    ● The SU-2000 provides flexible handling of substrates ranging   standard Si wafers to thin wafers.

    2. Compact Footprint
    ● Customers can   either two or four chamber configurations, accomodating the scale of their production needs.

    ● When the footprint of the SU-2000 (four-chamber specification) is compared with that of our existing two-chamber MP-2000, it is just 14 percent larger.
    This represents a major space saving and means the SU-2000 can be used to replace the MP-2000.

    ● The SU-2000’s chemical supply system is docked to the rear to improve processing control by minimizing the distance between the chemical supply source and the wafer. (All-in One concept) This decreases the footprint and increases process control.

    3. Thin Wafer Compatibility
    ● Due to the growing use of power devices, MEMS, TSV and BSI sensors, Screen has designed the SU-2000 to handle thin wafers.

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