AUROS Technology, Inc.

Hwaseong-si,  Gyeonggi-do 
Korea (South)
  • Booth: D120

Thanks for visiting Auros Technology. We always welcome you!

AUROS Technology is a world’s leading provider of the most advanced technologies that help our valuable customers continually make innovation and create the new life. As a technology oriented company, AUROS focuses on solving technical problems of customers in metrology area of semiconductor industry.


  • WBIS-200 -Be applied to the Compound Semiconductor
    8inch Wafer Inspection system, Be applied to the Compound Semiconductor ...

  • [Features] 
    - Apply a 20 optical system and vision algorithm to inspect scratches and particles

    - Area Capture by One Shot

    -  High Resolution & High Throughput ≥ 15% competitive than other

    -  Deep-Learning Solution to detect any scratch sources

    -  Capability for all wafer : EPI and Non EPI


    - Compound Semiconductor (Opto, CIS, Driver IC, PMIC, DDI) for IoT, AI, VR, Automotive Electronics

    - Materials such as Sic, GaN, GaAs, InP

  • OL-900n - High-end Overlay Metrology System
    Improving a Overlay Accuracy for Advanced Memory and Logic devices ...

  • [Features] 
    - Imaging-based Overlay Metrology System with the *MFIS for High Stack Layer

    - High Resolution & Large FOV imaging

    - *TWD to customize wavelength and filter for accurate and robust overlay error measurements

    - High Software functions : Dynamic De-skew & Shortest Path to improve overlay performance

    - Radial Action to optimize wafer edge areas

    *MFIS : Multi Focus Imaging System

    *TWD : Tunable Wavelength and Dual band


    - On-product Overlay Control  : Memory(DRAM, 3D NAND), Logic Foundry (CIS)

    - Specialized in High Stack, Opaque Layer

    - Measurement for FEOL/MEOL/BEOL

    - Data Analysis and management

  • OL-300nw - 12inch Package Overlay Metrology
    12inch Package Overlay Metrology, Exclusive Technology for Wafer level Package Overlay ...

  • [Features] 

    - Metrology the electrical connection between the top and bottom

    - Real cell & Overlay Key Measurement

    - Circle algorithm to optimize for TSV, micro bump

    - High Precision and High Throughput

    -  Data analysis tool (EUREKA)

    -  High-end 300mm(12”) automation compatible


    - Wafer Level Packaging Bump process

    - Fan-Out Bump and RDL process

    - Solder bump and micro bump stepper overlay  PR and Bump CD measurement

  • WaPIS-30 - 12inch Wafer Inspection System
    12inch Wafer Inspection System, Brand New System for Wafer Warpage 2D and 3D Inspection ...

  • [Features] 

    - 2D Inspection (scratch, crack, particle) & 3D Inspection (Warp, Bow and Peak value)

    - Simultaneously Capture 2D/3D by One Shot 

    - Highest Throughput ≥ 20% competitive than other

    - Freeform and Moire process concept

    - Moire module to inspect wafer warpage as light scattering

    - Deep-Learning Solution


    - Possible to measure the process variation of the package(HBM)

    - Compound Semiconductor (SiC, GaN, Si) using FAN OUT WLP and TSV

  • AEliT 8201(In Development) - Thickness Measurement
    Thickness Measurement System, Front-end Semiconductor Process for Memory and Logic ...

  • [Features] 

    - Focused beam small spot SE system

    - Ultra High Precision & Stability

    - High Throughput (150 WPH)

    - Broadband high power light source (DUV to IR)

    - Multi-Color Illumination for Pattern Recognition

    - QGA (Quick Global Alignment) technology

    - High Bow & Warp wafer handling using Super Flat Vacuum Chuck


    - Precise Thin film Process Control in

          - DRAM

          - VNAND

          - LOGIC

    - Ultra Thin film to Common film layers measurement capability including Multi-Stack layers

  • Clarity Product Suite -Sherlock, Clarity Pro, IRQS
    High-speed 2D/3D Wafer Inspection System, Macro, Micro and IR Defect Inspection ...

  • [Features] 

    - 2D & 3D Inspection at >120 WPH with DF Sensitivity <100nm and Z-height resolution of <10nm

    - Void, Crystal Defect & Strain Field Detection Capability <1 micron

    - Angstrom-level 3D Surface Imaging & Metrology for All Types of Substrates & Materials including both Bare & Patterned Substrates to <200nm XY-resolution


    - One-Shot 2D & 3D Macro Inspection Capability Including Topography Maps & Bump Measurements

    - One-Shot 2D & 3D IR Inspection Capability for Advanced Packaging & Compound Wafers

    - Defect Review & High-Speed AFM-level Surface Metrology

    - AI-based Defect Classification

BEWARE - Special Warning Notice about ExpoGuide and FAIRGuide

With the ongoing solicitations, SEMI would like to continue to alert you with questionable professional practices perpetrated against exhibitors by (Austria) and Expo Guide (Mexico), Event Fair - The Exhibitors' Guide with their misleading directory services. There may be others that we are not aware of and are hence not named here. 

These companies provide legitimate exhibition guides aimed at exhibitors across the globe offering online listing services. They use a form which resembles and organizer's free catalogue listing service, inviting exhibitors to complete the form for an entry in an on-line directory. Unsuspecting exhibitors who sign and return the form are then contracted into a three-year, non-retractable agreement, which could cost the exhibitor a significant amount of money, with very limited foreseeable benefits. The details are often available on the form itself, but are often too small and insignificant to be noticed. It is always wise to really the small print before signing a contract, and if the information is impossible to read then the contract should not be signed. These publications have no connection with SEMI or any of our events, and it is important that all companies are made aware of this. 

Should you receive any communication from the Expo-Guide and or related company, please IGNORE THEM COMPLETELY and DO NOT COMMUNICATE WITH THEM IN ANY WAY.

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