UBmaterials Inc.

Yongin-si, Gyeonggi-do, 
Korea (South)
  • Booth: B609

Company in slurry area for CMP process.

UB materials Inc., a Korean company, which is manufacturing CMP slurries for semiconductor use. We are manufacturing Tungsten CMP Slurry ,Poly-Si stop and Nitride-stop slurry. And also developing other slurries for semiconductor devices. We have the state-of-the-art technique for making slurry abrasive and slurry mixing system which was developed by Advanced Semiconductor Materials and Devices Development Center, Hanyang University which has long time successful experience in CMP slurry business field. We are pursuing a Excellent CMP slurry maker on ward and will keep on trying to achieve our Goal.​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​​


  • CMP Slurry
    1. 1-step tungsten(W) CMP slurry 2. Nano colloidal ceria slurry...

  • 1. 1-step tungsten(W) CMP slurry

    Slurry for tungsten(W) chemical mechanical planarization(CMP) - Including 25nm crystal ZrO2 abrasives - Applications : Formation of Tungsten plug, Tungsten line, Buried tungsten gate etc.

    2. Nano colloidal ceria slurry

    Slurry for poly-Si stop CMP slurry - slurry for nitride stop CMP slurry - Including CeO2 abrasives by a wet synthesis reaction - Application : shallow trench isolation(STI) CMP process, poly-Si stop CMP process etc.


    - CeO2 abrasives; 20nm, 40nm, 60nm and 70nm abrasive

    - Scratch less Poly-Si stop CMP slurry

    - Scratch less Nitride stop CMP slurry

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