Woowon Technology Co., Ltd.

Seongnam-si, Gyeonggi-do, 
Korea (South)
http://www.wwtech.co.kr
  • Booth: A410


Woowon Technology Co., Ltd

Woowon Technology Co., Ltd is a Representative and Distributor for major foreign equipment suppliers. Our highly experienced sales and support teams of over forty people provide world-class support that is focused on delighting both our Principals and Customers. The Headquarters is located in Bundang-gu, Seongnam-si and we have second office in Hwasung-si, third office in Icheon-si and forth office in Cheongju-si ensuring fast and effective operations. 

Woowon imports and supplies equipment   about thirty manufacturers based all over the World. We understand the unique company culture and local language to enable us to provide effective Equipment Sales, Logistics, Tool Installation and Start-up, Process Support, and Warranty Service. Our strong established network and highly capable team enable early market introduction of cutting edge technologies for our principals. Every day we leverage our twenty nine years of high technology experience to satisfy the needs of our customers


 Products

  • Gudeng Precision Industrial Co., Ltd. (Taiwan)
    Wafer and photomask handling solution...

  • Mask handling solution
    · EUV POD
    · Mask package
    · Nikon / Canon reticle case
    · RSP-150 SMIF POD
    · RSP-200 SMIF POD
    ? Wafer handling solution
    · 450mm MAC
    · 450mm FOUP
    · 300mm FOUP with 25slots/ 13slots
    · 200mm Wafer Cassette
    · 200mm Shipping Box
    · Cassette Box

    * Service
    · Cleaning Service
    · Mask Management and Tracking System
    · Mask Accessory

    FEATURES
    · Global innovative critical material technology provider, Low-outgas, haze reduction, ESD protection
    · Provide total solution to improve production yield
    · Optimize the carrier design to reduce particle generation or contamination
    · Customize products and co-test with customers

  • Oxford Instruments Pte. Ltd. (UK)
    Etch, Deposition and Growth Systems · Etch Process : ICP, RIE, RIE/PE · Deposition Process : ALD, ICPCVD, PECVD Growth Processes : CVD & PECVD...

  • APPLICATION
    · Optoelectronic device
    · Discrete device
    · Semiconductor device manufacture
    · Plasma process solution for MEMS & sensor

    FEATURES
    · Compact process module
    · Standalone load lock system/ clustered together handling unit
    · Auto matching unit & logging
    · Wide process range
    · Active uniformity control
    · Bosch/Cryo ICP process

  • sentronics metrology GmbH (Germany)
    Wafer inspection system with optical interferometry sensors...

  • APPLICATION
    · Measurement of layer thickness, total thickness, warp, micro bumps, TSVs, RST, RDL, UBM,
    roughness and flatness
    · For a wide range of applications   advanced packaging, FOWLP and 3D IC to MEMS,
    sensors and power ICs

    FEATURES
    · Tools available   2“ to 12“, all the way to panel size packaging, as well as bridge tools
    · Qualified at leading-edge IDMs, foundries, OSATs and research institutions, worldwide
    · In order to cover a wide range of applications, an integration of up to 8 different sensors is possible
    · All sensor configurations are also available with a high resolution HD-CMOS camera (Die-Recognition)
    · SECS/GEM link-up possible
    · Easy on-site upgrade of sensors possible -for future proof of systems to meet the demands of today and tomorrow

  • PVA Metrology & Plasma Solutions GmbH (Germany)
    SIRD (Scanning Infra-Red Depolarization) WSPS(Wafer Surface Preparation System) WSMS-I(Wafer Surface Measurement System with Integrated ICP-MS)...

  • SIRD (Scanning Infra-Red Depolarization)
    SIRD measures stress in optically transparent materials utilizing a non-contact and
    non-destructive technology
    APPLICATION
    ? Wafer manufacturer - Crystal growing / Sawing / Grinding / Lapping / Polishing / Epitaxy
    ? Device manufacturer - Epitaxy / Diffusion / Horizontal or Vertical furnaces / RTP / Annealing
    FEATURES
    ? Throughput : Full wafer image 5 min.
    (normal resolution, 300 mm-wafer) 10 wafer / Hour typical
    ? Housing : Stainless steel, clean room class 1 compatible
    ? Handling options : Open cassette handling bridging tool for different wafer sizes SMIF
    or FOUP load port optional host communication factory automation interface Wafer ID-reader

    WSPS(Wafer Surface Preparation System)
    WSMS-I(Wafer Surface Measurement System with Integrated ICP-MS)
    APPLICATION
    ? VPD (Vapor Phase Decomposition) preparation
    ? Metal contamination processing
    ? Wafer manufacturing : Contamination control
    ? Device manufacturing : Monitoring of production equipment: wet bench, furnace, etc.
    FEATURES
    ? Lowest Detection Limits
    ? Faster Delivery of Measurement Results
    ? Accurate Measurements through Precision, Error-Free, Chemical Dosing, Diluting, Mixing
    and Delivery to both VPD and ICP-MS operations
    ? Real Time Process Control
    ? Significant Reduction in Labor Costs

    Microwave plasma system
    APPLICATION
    ? Wire bond pre-clean
    ? Flip chip underfill (3D IC / Ultra Thin Wafer)
    ? WLP
    ? 3D-TSV recess etch
    FEATURES
    The plasma system 80 Plus GIGA is a fully automatic low-pressure microwave plasma system
    for cleaning advanced chip packages prior to die attach, wire bond, encapsulation and ball attach.
    The electrode-free energy is the key factor for processing substrates with attached dies.
    The plasma cleaning effect is based on chemical reaction of reactive plasma particles (radicals)
    guided through the downstream configuration.

  • ERS Electronic GmbH (Germany)
    Products for Thermal Chucks : AirCool® , AirCool® PRIME, AC3...

  • Application
    All major production/analytical probers
    Customer-specific equipment solutions
    Full hardware and software integrations available
    Space-saving chiller dimensions
    No separate purge air source required
     
    Features for AirCool®
    No liquids or Peltier elements
    MTBF>50,000 hours
    -10°C (200mm), 0°C (300mm) to 300°C
    Features for AirCool®  PRIME 
    Industry’s lowest soaking time
    Ultra low noise
    Fast transition times
    PRIME Thermo Shield
    Highest flexibility with modular surface design
    -65°C to 300°C

    Features for AC3 
    No liquid or Peltier elements
    MTBH >50,000hours
    -55 to +400℃
    Modular system, adaptable to individual testing requiremens
    High energy dissipation option with patented PowerSense® upgrade

  • HANBELL Vacuum Technology Co., Ltd. (Taiwan)
    Dry Screw Vacuum Pump ...

  • Applications
    Etch  / IMPLANT / CVD / ALD  / PECVD  / ASHING / PLASMA PROCESS
    / TRANSFER / LOAD LOCK  / SOLAR  / Lithium battery

    Features
    ?Designed by HANBELL and 100% made in Taiwan.
    ?Lowest power consumption.
    ?Compact size, light weight and plug-and-play installation 
    ? iPH/iPM, the best choice in harsh and medium semiconductor process. 

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