The centrotherm c.VERTICOO platform for batch-type wafer processing is ideally suited for many semiconductor device fabrication steps. The special design of process chamber and heating system provides maximum flexibility for all standard atmospheric and low-pressure CVD processes with temperatures up to 1100 °C.
The stand-alone system is available as high-throughput version for mass production or mini-batch equipment for R&D and low-volume production. Both models are outstanding for high performance, small footprint, low cost of ownership and ease of maintainance.
The high-volume furnace c.VERTICOO 200 combines a single-tube setup with dual boat logistics and fully automated carrier-to-carrier wafer handling ensuring Maximum throughput with batch sizes up to 150 wafers.
The mini-batch furnace c.VERTICOO Mini meets the demanding requirements of semiconductor device R&D and
allows customers to reduce development costs by processing a maximum of 50 wafers per batch.