02-531-7800

Centrotherm International AG

Gyeonggi-do, 
Korea (South)
http://www.centrotherm.de
  • Booth: DS16

We realize your individual application with demanding process Technologies - Wafer - Power Devices - MEMS / TSV - Optoelectronics - Advanced Packaging - Passive Components. Come and visit us at our booth DS16!

centrotherm is one of the leading developers and manufacturers of production equipment for various semiconductor technologies and applications, such as logic and memory devices (e.g. Flash, DRAM) power semiconductors (e.g. Si, SiC), LED, SMT, MEMS or sensor technology: The product portfolio comprises horizontal and vertical batch furnaces (atmospheric or vacuum processes), vertical high temperature furnaces (annealing up to 2050°C, oxidation up to 1350°C), single wafer systems up to 300 mm wafer diameter (RTP, low-temperature microwave oxidation).
For the microelectronics industry we offer vacuum soldering systems and conveyor furnaces for a broad spectrum of thermally activated processes, such as thick film processes (drying and sintering) or DCB (remelting and connection), LTCC and MLCC manufacturing (firing). 
Our equipment is designed for all needs:  R&D to mass production. 


 Products

  • c.ACTIVATOR 150
    High-Temperature Furnace for post Implantation annealing of Silicon Carbide (SiC) devices...

  • centrotherm c.ACTIVATOR 150 is especially designed for high-volume production. The unique design of the centrotherm process tube and heating System allows process temperatures up to 2000 °C.

    CARBON VACANCY ANNEALING
    Carbon vacancies (Vc) can be annihilated by long post annealing just below the temperature at which the Vc generation starts (~1500 °C). This process reduces Vc density and enhances carrier lifetimes.

    HYDROGEN ANNEALING FOR TRENCH OPTIMIZATION
    For the production of SiC trench MOSFET´s it is important to eliminate excessive E-fields at sharp trench corners. In order to enhance channel mobility, the trench has to be cleaned and smoothed. This can be achieved by hightemperature hydrogen annealing.

  • c.HORICOO 300
    Horizontal High-Throughput System for 300 mm Wafers...

  • The centrotherm c.HORICOO 300 horizontal batch-type system is designed for processing 300 mm wafers in mass production. Based on centrotherm‘s process Technology expertise in the semiconductor industry and its reliable horizontal batch-type systems, the c.HORICOO 300 is the high-throughput platform for state-of-the-art 300 mm wafer processing.

    The heating system comprises 5 dual-zone heating elements that provide the centrotherm well-know temperature uniformity as well as an optimal and steady process. The centrotherm Hydrox system supports wet oxidation processes with different moisture contents.

    Temperatures up to 1200 °C allow faster oxidation and shorter drive-in processes. The system is equipped with a modern touch operating HMI and factory-host coupling for MES connection. The latest CESAR II software enables a SEMI-compliant recipe management as well as remote control and maintenance.

    The modular concept of the c.HORICOO 300 also allows a single 4-stack version for lower throughput requirements.

  • c.RAPID 200
    Rapid Thermal Processing System for Compound Semiconductors...

  • The stand-alone RTP system c.RAPID 200 has been especially developed for multiple process requirements in R&D and production lines. High performance and flexibility combined with low cost of ownership make it the best choice in rapid thermal processing.

    The capability to run a substrate on a susceptor or within a box in combination with atmospheric or vacuum Operation enables a wide range of possible applications for compound semiconductors (e.g. for SiC).

    The pyrometer-based temperature measurement System enables processes at low and high temperatures. Independent lamp control combined with predictive PID Control provides excellent thermal accuracy and repeatability.

    The c.RAPID 200 operates with a fully automatic loading system.

  • c.VERTICOO 200 and c.VERTICOO Mini
    Vertical Wafer Process System for Silicon-based Semiconductors...

  • The centrotherm c.VERTICOO platform for batch-type wafer processing is ideally suited for many semiconductor device fabrication steps. The special design of process chamber and heating system provides maximum flexibility for all standard atmospheric and low-pressure CVD processes with temperatures up to 1100 °C.

    The stand-alone system is available as high-throughput version for mass production or mini-batch equipment for R&D and low-volume production. Both models are outstanding for high performance, small footprint, low cost of ownership and ease of maintainance.

    The high-volume furnace c.VERTICOO 200 combines a single-tube setup with dual boat logistics and fully automated carrier-to-carrier wafer handling ensuring Maximum throughput with batch sizes up to 150 wafers.

    The mini-batch furnace c.VERTICOO Mini meets the demanding requirements of semiconductor device R&D and
    allows customers to reduce development costs by processing a maximum of 50 wafers per batch.

  • c. OXIDATOR
    HIGH-TEMPERATURE FURNACE FOR Si AND SiC OXIDATION...

  • The centrotherm c.OXIDATOR 150 high-temperature oxidation furnace has been developed for the special needs of SiC oxidation but can also be used for silicon oxidation. It is designed for high-volume production. Thanks to the optional centrotherm Hydrox system c.OXIDATOR 150 also supports wet oxidation. Temperatures up to 1500 °C and all other supported features open up new possibilities to SiC oxidation and the development of an oxide layer with low interface trap density (Dit) and high channel mobility. The outstanding reactor has been designed for high performance, small footprint and low cost of ownership while offering highest process flexibility. The tube and the heating element inside the vacuum reactor chamber are designed to allow a safe use of toxic gases like O2, N2O, NO or WetOx. Post oxidation annealing in NO atmosphere leads to an improved SiO2/SiC interface, hence to higher channel mobility as well as improved stability and longevity of the oxide on SiC.

  • c.HORICOO 200
    HORIZONTAL BATCH-TYPE PROCESS SYSTEM FOR MULTIFOLD APPLICATIONS...

  • The centrotherm c.HORICOO 200 is a field-proven and ultra-versatile tube furnace system that is available for mass and medium volume production as well as for Research and Development. It provides reliable process capabilities and high process performance for multiple applications, such as atmospheric and low pressure diffusion as well as LPCVD and PECVD processes. Therefore, the process tubes can be configured for various processes with associated facilities (atmospheric, vacuum or mixed). All furnaces are equipped with an integrated boat handling that enables the storage of up to 8 process boats as well as an integrated wafer transfer system.vOutside influences are minimized by water-cooled heating cassettes and a soft-landing system. Ease ofmaintenance ensures low cost of ownership and a high uptime.

BEWARE - Special Warning Notice about ExpoGuide and FAIRGuide

With the ongoing solicitations, SEMI would like to continue to alert you with questionable professional practices perpetrated against exhibitors by FairGuide.com (Austria) and Expo Guide (Mexico), Event Fair - The Exhibitors' Guide with their misleading directory services. There may be others that we are not aware of and are hence not named here. 

These companies provide legitimate exhibition guides aimed at exhibitors across the globe offering online listing services. They use a form which resembles and organizer's free catalogue listing service, inviting exhibitors to complete the form for an entry in an on-line directory. Unsuspecting exhibitors who sign and return the form are then contracted into a three-year, non-retractable agreement, which could cost the exhibitor a significant amount of money, with very limited foreseeable benefits. The details are often available on the form itself, but are often too small and insignificant to be noticed. It is always wise to really the small print before signing a contract, and if the information is impossible to read then the contract should not be signed. These publications have no connection with SEMI or any of our events, and it is important that all companies are made aware of this. 

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