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Heller Korea, Ltd.

Suwon-si, Gyeonggi-do, 
Korea (South)
http://www.hellerkorea.com
  • Booth: C704

Heller Industries, founded in 1960, pioneered convection reflow ovens for soldering in the 1980's. Over the years, we have partnered with our customers to continually refine our reflow soldering ovens to satisfy advanced applications requirements. By embracing challenge and change, we have earned the position of World Leader in Reflow Soldering Technology.

 Products

  • Heller Pressure Curing Oven (PCO)
    A Pressure Curing Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications...

    • 860 Pressure Curing Oven (PCO)

    A Pressure Curing Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for bonding processes typically used in die attach and underfill applications.

    • PCO pressurizes air into a rigid vessel and heats & cools with forced convection.
    • Heaters, heat exchangers and blowers are internal to the pressure vessel.
    • When the curing process is complete, the Pressure Curing Ovens automatically relieves its pressure to 1atm and cools.

    Process Specification:

    • Process time: Generally 120 min or User’s spec
    • Operating temp: 60oC ~ 200oC
    • Maximum temp: 220oC
    • Operating pressure: 1 bar – 10 bar
    • Capacity: 24 Magazines (typical)
    • Cooling method: PCW (17oC – 23oC)
    • Cooling water pressure: 25 – 40 psi

      Pressure Cure Applications:

    • Composite Forming for the printing industry
    • Die Attach Curing
    • Wafer Laminating
    • Thermal Compress Bonding
    • Underfill Curing
    • Via Filling
    • Film & Tape Bonding
  • Flux-Free Formic Reflow Soldering
    Flux-Free Formic Reflow in Formic Acid Vapor Heller has designed and built a production ready horizontal Flux-Free Formic Reflow oven for formic acid vapor soldering. This new oven has been designed to meet Semi S2/S8 safety standards...

    • Flux-Free Formic Reflow in Formic Acid Vapor

    Heller has designed and built a production ready horizontal Flux-Free Formic Reflow oven for formic acid vapor soldering. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases).

    • Formic Acid has been shown to be an effective reducing agent in fluxless solder reflow
    • Excellent results demonstrated for wafer bumping application in horizontal reflow oven
    • Fluxless reflow utilizes gas phase Formic Acid (HCOOH) to replace standard fluxing agents
    • Eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps
    • No post-reflow flux clean facilitates inline application of epoxy and inline epoxy curing solution
    • Feasibility has been demonstrated with production grade oven
    • Extensive engineering efforts in safe, precision delivery of formic acid and abatement

    Flux-Free Formic Reflow Advantages

    • Can use any reflow profile (e.g., tent or soak profile) with formic acid
    • Can adjust formic acid profile in oven in conjunction with thermal reflow profile
    • Includes Formic acid safety system (i.e., sensors/detectors) adheres to industry standards
    • Includes Formic acid abatement systems for Green Process Solution
    • Includes real time formic acid concentration monitor system

Categories

200 Equipment, Assembly
  • Solder Reflow; Soldering & Brazing Equipment
    • 202 Equipment, General Use
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating


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