Gyeonggi-do, Hwaseong-si, 
Korea (South)
  • Booth: B907

NEXTIN, a technology-leading company in the patterned defect inspection field of the semiconductor industry, provides AEGIS wafer inspection systems for traditional wafer fabrication processes and IRIS wafer inspection systems for the 3-dimensional wafer fabrication process such as the High-Aspect-Ratio process of 3D flash memory. Our innovative technology is qualified by leading-edge memory and logic device manufacturers. We keep providing the best solutions for defect inspection to device manufacturers.


  • AEGIS Inspection System
    AEGIS series is the most cost-effective and high-performance equipment to achieve fast process stabilization and yield improvement by detecting various kinds of defects....

  • The AEGIS system with NEXTIN’s innovative two-dimensional imaging technology is a cost-effective, high-performance defect inspection equipment. The high-resolution CMOS sensor, which allows high-speed and high-precision inspection, provides high throughput, lowers noise, and results in a better signal-to-noise ratio (SNR) by applying two-dimensional imaging technology.

    Directional illumination filters out pattern signals and detects only interested pattern defects with high signals on the filtered images. Bright-field and dark-field inspection capability in one equipment can detect not only defects that are well detected by darkfield inspection but also defects that are well detected by brightfield.

    With this combo feature, AEGIS Wafer Inspection System can be used for all patterning (photo & etch) processes and film-related processes like CVD and CMP processes in FEOL (Front-End Of Line) and BEOL (Back-End Of Line).

  • IRIS Inspection System
    The IRIS system with NEXTIN’s innovative three-dimensional imaging technology is the sole solution for the 3-dimensional wafer fabrication process such as the high aspect ratio process of 3D flash memory or TSV process of high bandwidth memory (HBM)....

  • IRIS series is the wafer metrology-inspection system utilizing NEXTIN's patent-awarded technology called Multiple Off-focus Image Process Technology to measure the vertical structures and find pattern defects during the HAR process steps in 3D semiconductor devices, as well as TSV processing steps in the advanced 3D packaging processes. 

    Multiple Off-focus Image Process Technology is used as an ideal solution for 3D device process applications. Tunable single wavelength laser helps variable applications for different structures and materials in semiconductor processes from the front-end to the back-end. 

    Iris series provides the cost-effective solution, the smallest footprint for the metrology, the inspection of 3D devices, and the advanced 3D package processes. Die-to-Die algorism is available for defect inspection. 

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