The AEGIS system with NEXTIN’s innovative two-dimensional imaging technology is a cost-effective, high-performance defect inspection equipment. The high-resolution CMOS sensor, which allows high-speed and high-precision inspection, provides high throughput, lowers noise, and results in a better signal-to-noise ratio (SNR) by applying two-dimensional imaging technology.
Directional illumination filters out pattern signals and detects only interested pattern defects with high signals on the filtered images. Bright-field and dark-field inspection capability in one equipment can detect not only defects that are well detected by darkfield inspection but also defects that are well detected by brightfield.
With this combo feature, AEGIS Wafer Inspection System can be used for all patterning (photo & etch) processes and film-related processes like CVD and CMP processes in FEOL (Front-End Of Line) and BEOL (Back-End Of Line).