Saint Jeoire, 
  • Booth: A410

Develop the chips of the future with SET Flip-Chip Bonders.

Founded in 1975, based in France, SET is a world leading supplier of High Accuracy Flip-Chip Bonders (chip-to-chip and chip-to-wafer) and versatile Nanoimprint Lithography (NIL) solutions.

With equipment installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its flip-chip bonders.

Ranging from manual loading to fully automated version, the SET bonders adapt to all main bonding techniques: fluxless reflow, thermo-compression, adhesive joining compression, thermosonic…

SET offers a comprehensive product portfolio of flip-chip bonders for fast growing markets and serving clients through a global network of representatives (Woowon Technology in South Korea) and in-depth customer trainings.

 Press Releases

  • 3 minutes 20 seconds. That’s the record time announced in October 2019 by Google and the University of California, Santa Barbara (UCSB) to perform a calculation with a Sycamore quantum processor. A calculation that would have taken the most powerful computers 10,000 years. SET with its FC150 Flip-Chip Bonder was part of this recent achievement.

    Qubits Interconnected thanks to the FC150 Flip-Chip Bonder

    On October 23, 2019, Google announced a quantum breakthrough with the video Demonstrating Quantum Supremacy. The video was viewed more than 2 million times on YouTube in its first 24 hours. The FC150 appeared in the video as engineers were performing tasks.

    In an article jointly published by Google and UCSB in November 2017, the SET FC150 was cited as it was used to align and assemble a chip with a base substrate at room temperature with micrometric precision. This is part of a process that interconnects qubits - storage units specific to quantum computing.

    FC150:  a Flip-Chip Bonder for Advanced R&D

    With an accuracy of ± 0.5 μm, ± 1 μm after welding, the SET FC150 offers a wide variety of welding techniques, with configurations ranging from manual to all-automatic.

    With parallelism adjustment, aligning and soldering of components ranging in size from 0.2 to 100 mm, the FC150 meets almost all requirements for high-end welding applications, including reflow, thermocompression, bonding and fusion welding.

    The FC150 in detail

  • SUSS MicroTec and SET announce a partnership in sequential die-to-wafer (D2W) hybrid bonding, a die-based interconnect technology, to provide a fully automated, customizable, highest-yield equipment to customers. This solution will accelerate the industry’s path towards advanced 3D multi-die solutions such as stacked memory and chiplet integration.

    Saint-Jeoire, France and Garching, Germany - September 1st, 2021 - SUSS MicroTec -leading supplier of equipment and process solutions for the semiconductor industry- and SET -leading supplier of high precision flip-chip bonders- signed a joint development agreement to develop a cluster, including several modules such as surface preparation, cleaning, bonding and metrology.

    As part of this partnership, SUSS MicroTec’s high-efficiency surface preparation modules and throughput-optimized metrology solutions for post bond overlay verification will be combined with SET’s latest ultra-high accuracy D2W hybrid bonding platform.

    As today’s 2.5D and 3D packaging schemes are limited by the minimum interconnect density that traditional microbump technology can offer, hybrid bonding solves this problem by bonding the direct contact between two metal pads (mostly copper) and surrounding dielectrics in one single bonding step. This bumpless bonding approach allows for substantially smaller pitches and higher interconnect density which are the key enablers for future generations of multi-die solutions.

    Goetz M. Bendele, PhD, CEO of SUSS MicroTec:

    "Hybrid bonding is one of the main growth drivers of the advanced semiconductor backend equipment space, as well as one of the main growth levers for SUSS MicroTec. With our partnership with SET, we will be able to offer our customers a complete suite of both die-to-wafer and wafer-to-wafer hybrid bonding solutions for the broadest set of heterogeneous integration applications in the advanced backend space. Our die-to-wafer bonding solution, leveraging the combination of SET’s leading-precision die placement technology with SÜSS’s proven surface activation, automation, and metrology capabilities, will deliver additional customer value through differentiation in terms of throughput and yield, while at the same time enabling friction-less integration into our customers’ fabrication sites.”

    Pascal Metzger, PhD, CEO of SET:

    “Thanks to several partnerships we had & our more than 10 years experience in hybrid bonding, we have succeeded in taking hybrid bonding from a purely laboratory level (multi-partner project including CEA-Leti) to an industrial level (multi-partner project in the consortium IRT Nanoelec). Excellent technical results have been obtained and published in several conferences and industrial feasability has been demonstrated in CEA-Leti cleanrooms in Grenoble, France. Thus in September 2019, SET launched a stand-alone machine – the NEO HB. Thanks to our new partnership with SUSS MicroTec, we are now going to accelerate the integration and automation phase of the process. This will permit to provide a complete industrial solution to our customers, for applications coming in the very near future such as HPC (High Performance Computing), AI (Artificial Intelligence), 5G and many other more, to diversify our offer and address new market segments.”

    For more details on hybrid bonding at SUSS MicroTec and SET


    The NEO HB is a flip-chip bonder designed for ±1 μm @ 3σ post-bond accuracy in stand-alone or full automatic mode (EFEM)....

  • The NEO HB is suitable for hybrid / direct bonding processes.

    It combines high precision, flexibility and short cycle time.                                           

    It is dedicated for production.

  • ACCµRA Plus
    The ACCµRA Plus is a flip-chip bonder designed for 0.5 µm post-bond accuracy in full automatic mode....

  • The ACCμRA Plus is suitable for reflow and thermocompression processes.

    It combines high precision, flexibility and short cycle time.              

    It is dedicated for production in the fields of optoelectronic and silicon photonics applications.

  • ACCµRA 100
    The ACCµRA 100 is a semi-automatic flip-chip bonder designed for 0.5 µm post-bond accuracy....

  • The ACCµRA 100 combines high precision, accessibility and cost-effectiveness.

    Its flexibility makes it ideal for developing a wide range of applications.

    It is the perfect equipment for universities and R&D institutes.

    The ACCμRA OPTO is a flip-chip bonder designed for 0.5 μm post-bond accuracy....

  • The ACCμRA OPTO is dedicated for low force and reflow processes.                 

    Motorized axes guarantee a high repeatability of your process.

    The ACCμRA OPTO combines high precision, flexibility and accessibility.

    It is the perfect equipment for optoelectronics and silicon photonics applications.

  • ACCμRA M
    The ACCμRA M is a manual flip-chip bonder designed for 3 μm post-bond accuracy....

  • The ACCμRA M permits to align manually the components with a high level of precision.

    More than a pick-and-place system, it offers thermocompression and reflow capabilities.

    It is the perfect equipment for universities and R&D institutes.

  • FC150 and FC300
    The FC150 and the FC300 are very accurate flip-chip bonders dedicated for advanced R&D....

  • The FC150 is a high accuracy and versatile flip-chip bonder for chip-to-chip (up to 100 mm) and chip-to-wafer (up to 200 mm) applications on the same open platform. 

    It allows 1 µm post-bond accuracy.

    Perfect for advanced R&D, the FC150 is also adapted to pilot production thanks to its full automatization.


    The FC300 is a high accuracy and high force flip-chip bonder for chip-to-chip (up to 100 mm) and chip-to-wafer (up to 300 mm) applications.

    It allows 0.5 µm post-bond accuracy.

    The FC300 covers a large range of bonding forces, from 1 to 4000 N. That makes it perfectly suitable for reflow and thermocompression processes.

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