-. This system’s purpose is to detect Arc type scratches during CMP processing.
● Source of Arc type scratches
-. Wafer edge lifting
-. The Robot Arm or the wafer broken due to the external shocking factor
● Preventing Arc type scratches
-. This system alarms at the first sign of any Arc type scratch within the retainer ring,
indicating tool for PM evaluation.
● Expectancy effect
It can detect scratch defects in advance so that you can prevent dozens or hundreds of wafer defects