KYZEN

MICRONOX MX2708 is formulated for the demanding cleaning challenges presented within leadless devices such as low standoff gaps and fine pitches of Cu Pillar flip chips, 2.5D/3D ICs, SiP and AiP. MX2708 completely removes organic acid residue of all kinds at low, safe operating concentrations all while having no effect on exposed metal and intermetallic alloys including Cu, Al, Sn, Pb, Ni, Ag, and Au finishes. MICRONOX MX2708 most effectively cleans organic acid flux residues at lower concentrations in spray-in-air cleaning systems.

• Effectively Cleans Under Highly Dense Die Without Reacting with Exposed Metals
• SAC, Aluminum and Copper Safe
• Lowers Surface Tension
• Superior Rinsing Ability

AQUANOX A4727DT is designed to remove difficult No-Clean flux residues for all types of advanced packaging. With outstanding buffer technology, A4727DT can be used at low concentration and offers stable pH throughout its long bath life. Its gentle formula also provides great compatibility with all sensitive metals and makes it a good solution for advanced packaging devices such as SiP, PLP and Flip Chip packaging. Even under fine pitch and low standoff gap height, AQUANOX A4727DT is easy to rinse completely in in-line cleaning systems.

• Superior & Complete Rinsing
• Exceptional Cleaning of ALL Widely Used Assembly Materials
• Components, Coatings, Labels and Equipment Compatible
• Stable and Economical Process Conditions