FST (Fine Semitech Corp.)

Definition & Usage

A pellicle is a thin membrane stretched over an aluminum frame and glued to the photomask to protect it from contaminants, such as particles. Even if particles sit on the membrane, they are not printed on the wafer because they are out of focus during the exposure from the lithography process. 

Purpose of Use

• To improve the yield rate of IC chips
• To extend the cleaning period of the photomask
• To protect the photomasks from contamination
• To extend the lifetime of the photomask
• To isolate sources of contamination

The Chiller of FST is an equipment that improves process efficiencies by constantly maintaining
inside-chamber wafer and its surrounding temperatures, through the excessive heat produced in semiconductor etching process. As the process becomes more micro and solid, continuous development of Chiller is requested for more customized equipment supply. Accordingly, products of various fundamental technology and design technology basis are being manufactured.

• Thermoelectric Chiller
  • Momentary Power Outage Resistance (Power Vaccine) 
  • High Efficiency(Hiper) TEM & Block 
  • Compact Size & User-friendly Structure 
  • High Accuracy & Fast Response Temperature Control (±0.01℃) 
  • IGBT Circuit, Non-defective SMPS 

• Compressor-type Chiller
  • High-reliability Refrigeration Components and Cycle 
  • Low Noise, Low Power Circulation System (50% Reduction) 
  • Momentary Power Outage Resistance (Power Vaccine) 
  • Energy-saving Refrigeration System (60% less power) 
  • Seismic & Vibration-resistance Design 

• Heat Exchanger
  • High-reliability Components and Sensors 
  • Low Noise, Low Power Circulation System (50% Reduction) 
  • Momentary Power Outage Resistance (Power Vaccine) 
  • Precision Control 3-Way Valve (±0.01℃) 
  • Seismic & Vibration-resistance Design 

• Cryogenic Chiller
  • High-reliability System under Cryogenic Condition (Dew condensation, Freezing Prevention) 
  • Rapid Cooling and Maintaining (20 ▶ -80℃, 10min.) 
  • Momentary Power Outage Resistance (Power Vaccine) 
  • Special Refrigeration System Extra Low Temperature (7kW@-70℃) 
  • Seismic & Vibration-resistance Design 

• THC (Temp & Humidity Controller)
  • Energy Saving Refrigeration System (60% Reduction) 
  • Temperature / Humidity Stability (±0.01℃ / ±0.2%)        
  •  Momentary Power Outage Resistance (Power Vaccine) 
  • DI Supply Stabilization System 
  • Seismic & Vibration-resistance Design 

• Application
  • EUV Pellicle & Pelliclized EUV Mask Inspection
• Key Features
  • 1um PSL equivalent particle inspection
  • Inspection Throughput: 15mins/pellicle, 16mins/pelliclized EUV Mask Automation
• Automation
  • EUV mask auto track in/out by supporting OHT (OHT: Overhead Hoist Transport)
  • EUV pellicle stock & retrieve (Auto EUV pellicle case open with unclipping)
  • Automatic defect review
  • Automatic defect classification on pellicle membrane (front side, back side, hole)
  • Support various application of inspection for EUV Pellicle and/or pelliclized  EUV Mask
    • Incoming EUV Pellicle quality control: Inspection defectivity & mechanical strength)
    • Pellicle status monitoring: Membrane stability after certain number of shots by scanner
    • Mask exterior inspection: backside, edge & etc.

• Application
  21. Fully Automated EUV Pellicle Mounting & Demounting
• Key Features
  21. High throughput
  21. Automation
      • EUV mask auto track in/out by supporting OHT (OHT: Overhead Hoist Transport)
      • EUV pellicle stock & retrieve (Auto EUV pellicle case open with unclipping)
  21. Precise process control
      • Glue dispensing control: shape & volume monitoring
      • Fine heat-temperature control: stud fixation & removal process
      • Various vision monitoring tools: preventing pellicle breakage during mounting & demounting process
  21. Small footprint

EUVO TM (Extreme Ultra Violet Oscillator) is based on High-order Harmonic Generation driven by ultra-fast laser.
The system has excellent coherence, low divergence, tunable wavelength, and table-top size footprint.
It is compact, easy to use, reliable, and cost effective EUV light sources. It is uniquely suited for Infrastructure of EUV Lithography and its applications.

• High-order Harmonic Generation driven by ultra-fast laser
  • Excellent coherence
  • Low divergence
  • Table-top size footprint
  • Tunable wavelength
• Application
  • Mask defect review system
  • EUV transmittance/reflectance measurement system
  • EUV interferometer
  • Coherent scattering microscopy

• Key Features
  • Photomask & pellicle defect inspection (particle, scratch, bumps, holes)
    • Mask front/back side, pellicle membrane, frame (inner, chamfer)
  • ADR (Automated Defect Review) function to review automatically and discern the location of particles above or below membrane
  • Customizable inspection areas
  • High throughput and accurate detection