SCREEN SEMICONDUCTOR SOLUTIONS Co., Ltd.

Description:

Equipped with three lenses in different resolutions

A wafer pattern inspection system with high resolution and high productivity

Features:

1. Doubling the throughput of the previous model

2. Able to detect and analysis of micro-defects smaller than 1μm

3. Easy to create recipes using actual wafer images

1. High-Throughput while Ensuring High Reliability

Running dual, parallel process lines dramatically improves wafer throughput. Since the load is distributed between two separate lines, the SOKUDO DUO also contributes to higher wafer handling robotics reliability since it enables reduced wafer transfer speeds without compromising wafer throughput.

2. Non-Stop Operation Delivers High Productivity

The dual-flow concept makes it possible to run each wafer process line independently. Maintenance can be performed while the system is running production, greatly reducing system downtime. The overall lithography cell wafer output, productivity is optimized by keeping the coat/develop process running so that expensive photolithography exposure scanner time is not wasted.

3. Small Footprint & Flexible Configuration

The dual process line system is a compact platform design that significantly reduces footprint. Various system configurations can be tailored to match specific coat/develop applications to deliver optimized wafer output for the available clean-room area.

4. Advanced Lithography Technology

With SCREEN’s over 30-year technical know-how, the system supports advanced immersion ArF lithography, EUV, E-Beam and Directed Self-Assembly (DSA) coat / develop / bake track solutions to realize high yield for volume production.

1. High productivity

In an industry-first1 for a scrubber type system, the SS-3300S is equipped with a new platform enabling installation of up to 16 chambers. A new dual transport system dramatically improves production volume for the system’s footprint, helping the SS-3300S achieve the industry’s highest practical throughput of up to 1,000 WPH2.

2. Space-saving design

The SS-3300S has a footprint 27% smaller than two 8-chamber SS-3200 spin scrubbers, saving space and delivering exceptional cost performance.

3. Control system revamped

The redesigned control system means the SS-3300S is ready for IoT and inter-system connection, adaptable for the current transition to smart factories.

4. Emissions reduction solution (optional)

An optional exhaust recirculation system reduces total emissions by 65%, ensuring clean equipment operation to support ESG measures.

1. Based on SCREEN in-house research (as of December 2020)

2. Peak throughput during continuous operation running with the same flow recipe

1. Controls heating temperature profiles by the millisecond

The LA-3100 precisely controls the thermal dosage profile of several milliseconds from a xenon flash lamp, which heats the wafer instantly using flash of light.

The wafer surface temperature can be lowered or raised at mid- to high speed, making heat processing with a low thermal budget a reality.

This in turn allows for a high level of activation for the dopant injected into the source/drain, along with precise control of the concentration profile.

2. Low oxygen atmosphere

Single wafer processing makes it possible to anneal in a strictly-controlled low oxygen atmosphere.

3. Functionality for measuring wafer temperature during heat irradiation

The LA-3100 features new functionality for precisely controlling the heat treatment of the entire wafer surface in milliseconds, while measuring the wafer temperature during heat irradiation. This makes it easy to understand and solve physical phenomena with a focus on temperature control, starting with the R&D stage.

1. High Throughput

The FC-3100 is capable of achieving a high throughput of 650 wafers per hour, which has been realized by incorporating a high throughput buffer module and a high-speed transfer module.

2. Stable and Highly Reliable

Seven independent modules can be easily configured to best suit your production needs. Each module is of standardized construction. Dual cleaning baths are built into a single compact module for smoother assembly, adjustment, testing and installation.

3. Low Pressure Drying System (HiLPD)

Provided with the HiLPD, a low pressure drying system, the FC-3100 is able to provide high concentration IPA vapor without using carrier N2 gas to greatly suppress watermark generation. In addition, the high concentration IPA vapor rapidly reduces surface tension preventing pattern collapse.

*Compared with conventional model