Established in 2014, Glint Materials is the first pioneering company developing and manufacturing high-friction dry adhesive pads, especially for the semiconductor and display industry which requires precise substrate handling. Our unique technology provides the controllability of directional adhesion force.
For example, strong horizontal adhesion force but popping free when the substrate is separated from the pad.
Conventional substrate handling methods are limited to resolving chronic issues such as sliding, misalignment, contamination, and damage in the semiconductor and display industry.
SurfCon® is an innovative dry adhesive high friction pad solution that is inspired by precision polymer engineering and micro patterning technology.
Glint Materials has highly educated and semiconductor industry-oriented human resources who can provide various kinds of material solutions depending on customers’ technical requirements.
Glint Materials is growing as a globalized manufacturer that can immediately respond with tailored solutions for customers worldwide.