02-531-7800

EV Group Korea Ltd.

Gyeonggi-do, 
Korea (South)
http://www.EVGroup.com
  • Booth: A644


Welcome to visit us at Booth #A544 for EV Group (EVG).

EV Group(EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices.
A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.
With state-of-the-art application labs and cleanrooms at its headquarters in Austria, U.S. and Japan, EVG is focused on delivering superior process expertise to its global R&D and production customer and partner base?  the initial development through to the final integration at the customer’s site. Founded in 1980, EVG services and supports an elaborate network of global customers and partners all over the world.
More information about EVG is available at www.EVGroup.com.


 Products

  • GEMINI®FB-Automated Production WaferBonding System
    Integrated platform for high precision alignment and fusion bonding...

  • Vertical stacking of semiconductor devices has become an increasingly viable approach to enabling continuous improvements in device density and performance. Wafer-to-wafer bonding is an essential process step to enable 3D stacked devices. EVG's GEMINI FB XT integrated fusion bonding system extends current standards and combines higher productivity with improved alignment and overlay accuracy for applications such as memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning. The system features the new SmartView NT3 bond aligner, developed specifically for fusion and hybrid wafer bonding alignment requirements of < 50 nm.

    Features

      • New SmartView® NT3 face-to-face bond aligner with sub 50 nm wafer-to-wafer alignment accuracy
      • Up to six pre-processing modules like:
        • Clean module
        • LowTemp™ plasma activation module
        • Alignment verification module
        • Debond module
      • XT Frame concept for highest throughput with EFEM (Equipment Frontend Module)
      • Optional features:
        • Debond module
        • Thermocompression bond module
  • EVG®6200 NT-Mask Alignment System
    The EVG®6200 NT mask aligner is a versatile tool for optical double-side lithography and wafer sizes up to 200 mm....

  • Known for its automation flexibility and reliability, the EVG6200 NT provides state-of-the-art mask alignment technology on a minimized footprint area combined with the utmost throughput, advanced alignment features and optimized total cost of ownership. Operator-friendly software, minimized time for mask and tooling changes, as well as efficient worldwide service and support makes it the ideal solution for any manufacturing environment. The EVG6200 NT or the fully-housed EVG6200 NT Gen2 mask alignment systems are available in semi-automated or automated configuration and equipped with integrated vibration isolation to achieve excellent exposure results for a wide range of applications, such as exposure of thin and thick resists, patterning of deep cavities and comparable topographies, as well as processing of thin and fragile materials such as compound semiconductors. Furthermore, the EVG’s proprietary SmartNIL technology is supported on both semi-automated and fully automated system configurations.

    Features

    • Wafer/substrate size from pieces up to 200 mm/8’’
    • System design supporting versatility of lithography processes
    • Throughput up to 180 WPH in first print mode or up to 140 WPH in automatic alignment mode
    • Fragile, thin or warped wafer handling of multiple wafer sizes with quick change-over time
    • Automated contact-free wedge compensation sequence with proximity spacers
    • Auto origin function for precise centering of alignment key
    • Dynamic alignment function featuring real-time offset correction
    • Supports the latest UV-LED technology
    • Rework sorting wafer management and flexible cassette system
    • Manual substrate loading capability on automated system
    • Field upgradeable from semi-automated to fully automated version
    • Minimized system footprint and facility requirements
    • Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
    • Advanced Software features and compatibility between R&D and full-scale production
    • Agile processing and conversion re-tooling
    • Remote tech support & SECS/GEM compatibility
    • Table top or stand-alone version with anti-vibration granite table
    • Additional capabilities:
      • Bond alignment
      • IR alignment
      • Nanoimprint lithography (NIL)
  • EVG®520 IS-Wafer Bonding System
    Single or dual chamber wafer bonding system for low volume production...

  • FeaturesThe EVG520 IS single-chamber unit handles wafers up to 200 mm with semi-automated operation for small-volume-production applications. Redesigned based on customer feedback and EV Group's continuous technological innovations, the EVG520 IS features EV Group's proprietary symmetric rapid heating and cooling chuck design. Advantages such as independent top- and bottom-side heater, high-pressure-bonding capability, and the same material and process flexibility as on manual systems contribute to the success of all wafer bonding processes.

    Features

    • Fully automated processing with manual loading and unloading including external cooling station
    • Compatible with EVG mechanical and optical aligners
    • Single- or double-chamber automated system
    • Fully automated bond process execution and bond cover movements
    • Integrated cooling station for high throughput
    • Options:
      • High vacuum capability (1E-6 mbar)
      • Programmable mass flow controller
      • Integrated cooling
  • LITHOSCALE®-Maskless Exposure Lithography Systems
    LITHOSCALE® is a revolutionary, highly versatile maskless exposure lithography platform geared for a variety of microfabrication applications accommodating wafers up to 300 mm....

  • The LITHOSCALE system featuring EV Group’s MLE™ maskless exposure technology tackles legacy bottlenecks by combining powerful digital processing that enables real-time data transfer and immediate exposure, high structuring resolution and throughput scalability. Its mask-free approach eliminates mask-related consumables, while the exposure system with its tunable solid-state laser source is designed for high redundancy and long life-time stability with unique auto-calibration capabilities that minimize maintenance. Powerful real-time digital processing enables immediate exposure from the design-file to the substrate – thereby avoiding hours of conversion time for each digital mask layout.  LITHOSCALE features high-resolution (<2µm L/S), dynamically die-level addressable exposure of the entire substrate surface, which enables agile consumable-free processing and low cost of ownership (CoO). The LITHOSCALE system integrates full-wafer top-and-backside alignment utilizing dedicated objectives with visible and IR capability and proprietary chuck designs accommodating wafer sizes up to 300 mm. The system features dynamic alignment modes with an automatic focus, in order to adapt to the substrate material and surface variations. The ability to finely control focus level position keeps sidewalls steep as well as desired 3D contour of the resist, while preventing edge topping and footing. Large working distance and automatic adaptive focus ensures patterning uniformity across the exposure surface. It also offers individualized die processing capability, while fast full-field positioning and dynamic alignment enable high scalability for a range of substrate sizes and shapes.

    Features

    • Wafer/substrate size up to 300 mm/12’’
    • Resolution capability < 2 µm L/S
    • Equipped with MLE technology featuring high-end diffraction-limited optics
    • Exposure spectrum of 375-nm and/or 405-nm wavelength; user definable either as single, broadband or any kind of wavelength mixture
    • Regularly monitored and auto-calibrated solid-state light source securing its long-life-time stability and high redundancy
    • Advanced alignment modes supporting top-side and bottom-side VIS and IR alignment capability
    • Depth of focus control (DoF) < 24 µm
    • Adaptive autofocus control (AF) < 100 µm
    • High-precision field proven alignment stage embedding high-tech mechatronics and calibration sensors for entire system stability
    • Advanced software features including:
      • Dynamic die-level annotation
      • Advanced distortion compensation
      • Mask-file transfer and recipe execution via host/flexible per each wafer
      • Layout transformation function
      • Alternative format files support: Gerber, ODB++, OASIS
    • Automated contactless wedge compensation sequence
    • Scalable solution accommodating R&D and high-volume manufacturing (HVM) needs in one system without adding to footprint
    • Consumables-free technology
  • EVG®7300-Multifunctional UV Nanoimprint Lithograph
    Multifunctional UV Nanoimprint Lithography system up to 300mm featuring SmartNIL® technology, lens molding and lens stacking in one tool...

  • The versatile EVG®7300 UV Nanoimprint Lithography System can support multiple related UV processes: SmartNIL, Wafer Level Optics (WLO) and Stacking – three capabilities merged in one flexible tool.

    It is a standalone system based on the modularized and improved SmartNIL module, which can be configured depending on handling and automation levels. Supporting wafer sizes from 150 mm up to 300 mm and featuring high-precision alignment down to 300 nm, advanced process control and high throughput, the EVG®7300 can serve advanced R&D up to high-volume manufacturing (HVM) needs for a variety of freeform and high precision nano- and micro optical components and devices. For the necessity of integrated pre- and post-process flows in HVM environments, the module can be integrated into the HERCULES NIL system.

    This multi-functional system is designed to serve a wide range of emerging applications involving micro- and nanoimprints as well as UV-stacking of functional layers. Thus, the equipment enables enhanced process performance for wafer-level optics (WLO), nanophotonics, metasurfaces and biomedical chips. This is closely related to the industry needs for novel optical sensors and optoelectronics to enable e.g. autonomous driving, micro lens arrays and projectors in automotive and decorative lighting, diffractive optics for biometric authentication as well as emerging trends for sophisticated meta-lenses. First applications utilizing this technology already exist today in the field of advanced biomedical devices and augmented reality waveguides where nanoimprinting enables high quality manufacturing of complex designs.

    Features

    • Flexibility: UV-NIL system enabling three UV processes in one tool: SmartNIL, WLO and Stacking
      • Precisely controlled multistep process including alignment, contacting and UV-curing
      • Low-force automated stamp detachment for SmartNIL and WLO
    • Scalability: Processing wafers up to 300mm substrates
    • Modularity: Standalone module, as well integration into HERCULES NIL
      • Substrate handling: from manual loading to fully automated operation
      • Optional automatic stamp loading for SmartNIL allowing continuous mode operation
    • Advanced Alignment Capabilities
      • Live alignment <± 300nm (process dependent)
    • UV LED lamp up to high power 500mW/cm²
      • > 90 % uniformity
      • Optional: Dual wavelength operation: 365nm and 405nm
      • Different exposure modes
    • Optional Features
      • Optical wedge error compensation (WEC)
      • Temperature-controlled chuck
    • Industry leading process performance
      • Resolution down to single nanometer range
      • Very precise residual layer control
  • EVG®150-Automated Resist Processing System
    The EVG®150 is a fully-automated resist processing system providing highthroughput performance and supporting wafers up to 200 mm in diameter....

  • Designed as a fully modular platform, the EVG150 provides automated spin/spray/develop processes with high throughput. A new ultra-compact design with footprint < 3 m2 and redesigned modules enables easy access of individual chambers as well as the robot area. To minimize downtime, single modules can be serviced while the remaining system can be kept up and running. The system features four wet processing modules and up to 20 bake/chill units. Outstanding throughput values for real-life processes can be achieved by using a high-speed, high-accuracy robot and advanced scheduler algorithms. Even though the system exhibits a very compact design, up to 12 pumps and resist bottles can be installed inside the main frame. The EVG150 guarantees highly uniform coats ranging from demanding thick resist applications down to sub-micron layers.

    Wafers with high topography can be uniformly coated by EVG’s proprietary OmniSpray ultrasonic atomization technology, where traditional coating encounters limitations. Up to four XY spray coat modules can be installed in the system, which allows unrivalled spray coating throughput.

    Versatile combinations of multi-functional modules provide great opportunities in many fields of application like MEMS, image sensors, advanced packaging, RF, 5G, 3D sensing, photonics, automotive and power electronics manufacturing.

    Features

    • Wafer sizes up to 200 mm
    • Four wet process modules in any combination
    • Up to 20 hot/chill plates stacked inside the tool
    • Two or four loadports; cassette stations in full compliance with SEMI S8 ergonomics standard
    • Encapsulated chambers prevent cross-contamination
    • Chemistry within base frame: Pumps and resists in shortest distance to point of use
    • Sophisticated robot handling for highest throughput; placement accuracy < 50 μm
    • Handling of thick or ultrathin, fragile, bowed or small-diameter wafers
    • Flexible pressure dispense system with high-precision flow meters for spin coating; bottle sizes up to 1 gal
    • Complete temperature control for resist and developer lines
    • OmniSpray®: conformal coating of extreme topographies; up to two nozzles per module
    • Bake modules with a uniformity <± 0.4 % across the whole temperature range up to 250 °C
    • Optional: solvent bakes with double-side heating and hightemperature bakes up to 350 °C
    • Extensive range of supported materials: thin and thick negative and positive resists, dielectrics, colored resists, adhesives & polyimides
    • Process technology excellence and development service
    • GUI with multi-user concept
    • Smart process control and data analysis feature [Framework SW Platform]
      • Integrated analysis features for process and machine control
      • Equipment and process performance tracking feature
      • Parallel/queueing task processing feature
      • Smart handling features
      • Occurrence and alarm analysis
      • Smart maintenance management and tracking

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