Rokko Electronics Co., Ltd.
Continue to strive for leading the semiconductor production
Introduction of the original process `ROKKO puremium process` turned to the visitor troubled by knife-edge or the cleanning factor on the back of a pattern (particle and contamination) while thinning processing of the wafer for power and sensors progressed,Back grind ojf 6-inch SiC and sapphire wafer,polish(CMP),proposal of washing technology.