RPS CO., LTD.

Daejeon, 
Korea (South)
http://www.rps-korea.com
  • Booth: A162


Welcome to RPS, a leader in high precision machining parts.

RPS Co., Ltd. which has the best technology and the biggest production capacity in the field of Air & Ball Bearing Spindles and Ceramic Vacuum Chuck Table in the domestic market keeps growing on the basis of technological capability proven by companies which lead the conductor and display market of the world and experiences accumulated in the industry over the years.

Since its establishment, management and staffs of RPS Co. have united and done their utmost to maximize company value with quality and technologies under our managemnet principles of "Change and innovative management, successful management and management with which everybody is satisfied." As a result of such efforts, RPS Co. has opened the door to advancing into the global market.

We will build our position firmly in the center of the market for Super precision machining spindle which is changing rapidly and are committed to being reborn as a world class company by maximizing our core capabilities in each business area.

 Products

  • RUV400S
    Ultra Sonic CNC Machine for Micro drilling....

    • Based on our air bearing spindle manufacturing technology, we have succeeded in developing a CNC machine equipped with an ultrasonic air bearing spindle.
    When machining micro holes in difficult-to-cut materials such as Si, quartz, and ceramics, materials used in semiconductors, compared to existing equipment, tool life and quality are improved, productivity is improved by reducing machining time, and equipment life is improved by reducing machining load. It has differentiated itself from existing equipment.
  • Air Bearing Spindle
    When compressed air is supplied through the nozzle of the bearing, the internal rotary shaft is lifted by pressure and becomes free. This state is frictionless and does not interfere with the outside, so very precise control is possible....

    • The RPS produces spindles that are used throughout the industry.
    Air bearing spindles are more precise in machining with higher rotational speed than Ball bearing spindles.
    In many fields such as semiconductor wafer dicing, drilling, and grinding, Air bearing spindles are used to process them.
  • Ball Bearing Spindle
    Ball bearing spindle specially designed for precision processing rather than conventional spindle requiring precise vibration/speed control and corresponding output....

    • Ball bearing spindle specially designed for precision processing rather than conventional spindle requiring precise vibration/speed control and corresponding output.
  • Chuck Table
    Back Grinding Chuck Table (Wafer Grinding)...

    • In addition to chuck tables for wafer backgrinding in the picture, we also produce chuck tables necessary for semiconductor dicing and display processing, and we can customize them according to customer requests.
    SUS body chuck table, AL body, ceramic body, etc. can all be produced, and general porous and electrification porous are also available.
  • Air Bearing Cylinder
    A cylinder product that applies air bearing with the principle of floating an axis using compressed air. It can control fast reaction speed and high precision, and it can also control air blower and air suction....

    • A cylinder product that applies air bearing with the principle of floating an axis using compressed air. It can control fast reaction speed and high precision, and it can also control air blower and air suction.
    Generally used in manufacturing and inspection processes such as semiconductors, wafers, PCBs, glass, etc
  • Dicing Spindle
    As an air bearing spindle used in the wafer dicing saw process....

    • As an air bearing spindle used in the wafer dicing saw process, which is a post-process during the semiconductor manufacturing process, it is capable of ultra-high-speed and ultra-precision rotation of 2.4kW (up to 60,000rpm), excellent rotational precision, and features low noise and low vibration.

Categories

200 Equipment, Assembly
  • Backgrind; Slicing; Lapping; Polishing Equipment
  • Dicing; Sawing; Scribing; Separation Equipment
    • 202 Equipment, General Use
  • Cutting; Drilling; Laser ablation; Beveling Equipment
    • 401 Sub-systems
  • Pneumatic Systems; Pneumatic rotary spindles
    • 903 LED
  • FPD Glass Substrate Processing Equipment, Materials and Parts
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