Woowon Technology Co., Ltd.

Seongnam-si, Gyeonggi-do, 
Korea (South)
http://www.wwtech.co.kr
  • Booth: A210


Woowon Technology Co., Ltd

Woowon Technology Co., Ltd is a Representative and Distributor for major foreign equipment suppliers. Our highly experienced sales and support teams of over forty people provide world-class support that is focused on delighting both our Principals and Customers. The Headquarters is located in Bundang-gu, Seongnam-si and we have the second office in Hwasung-si and the third office in Icheon-si ensuring fast and effective operations. 

Woowon imports and supplies equipment to about thirty manufacturers based all over the world. We understand the unique company culture and local language to enable us to provide effective Equipment Sales, Logistics, Tool Installation, and Start-up, Process Support, and Warranty Service. Our strong established network and highly capable team enable the early market introduction of cutting-edge technologies for our principals. Every day we leverage our thirty years of high technology experience to satisfy the needs of our customers.

 Products

  • sentronics metrology
    Wafer Inspection System With Optical Interferometry Sensors...

    • Application
    Measurement of layer thickness, total thickness, warp, micro bumps, TSVs, RST, RDL, UBM, roughness and flatness
    For a wide range of applications from advanced packaging, FOWLP and 3D IC to MEMS, sensors and power ICs
    Features
    Tools available from 2“ to 12“, all the way to panel size packaging, as well as bridge tools
    Qualified at leading-edge IDMs, foundries, OSATs and research institutions, worldwide
    In order to cover a wide range of applications, an integration of up to 8 different sensors is possible
    All sensor configurations are also available with a high resolution HD-CMOS camera (Die-Recognition)
    SECS/GEM link-up possible
    Easy on-site upgrade of sensors possible - for future proof of systems to meet the demands of today and tomorrow
  • Oxford Instruments
    Etch, Deposition and Growth Systems ...

    • Application
    Optoelectronic device
    Semiconductor device manufacture
    Plasma process solution for MEMS & sensor
    Features
    Standalone load lock & cluster system
    Auto matching unit & logging
    Wide process range
    Active uniformity control
    Bosch / Cryo ICP process
    Multi-module range
    Multi-step processing without breaking vacuum
    Simultaneous processing for higher throughput
    Designed for high volume/value manufacturing
    Controllable, repeatable processes via recipe-driven software interface
    Cassette to cassette handling
  • Bruker Corporation
    Nanomechanical test instrument...

    • Application
    Young's modulus, hardness, fracture toughness test
    Quantify scratch resistance, critical de-lamination forces, friction coefficient test
    Semiconductor, data storage, MEMS, polymer, composite material
    Features
    In-situ SPM imaging as standard
    Advanced control module with DSP technology
    Dual head testing capability for nano / micro scale connectivity
    26x faster feedback for superior control
    Force sensitivity with <30nN noise floor for unprecedented accuracy
    Active vibration isolation system
    Integrated temperature / humidity sensor
    All-digital color optics interfaced with a 1394-IEEE cable
  • scia Systems GmbH
    scia Trim 200 Precise surface correction by Ion Beam Trimming (IBT)...

    • Applications
    Frequency trimming of bulk acoustic wave (BAW) or surface acoustic wave (SAW) filters
    Thickness trimming of silicon on insulator (SOI), quartz, lithium tantalate (LT) or lithium niobate (LN) wafers
    Film thickness error or step height correction in thin film head (TFH) manufacturing
    Dimensional correction of MEMS structures
    Features
    Significant yield improvement
    Film thickness homogeneity to be adjusted down to atom level of 0.1 nm
    No edge exclusion with electrostatic chuck
    Sub-nanometer removal with zero base etch function
    Processing of film and wafer materials without restrictions
    Throughput and maintenance optimized design for low production costs
    Processing of wafers with photoresist masks due to good wafer cooling
    Principle
    Focused broad ion beam scans across wafer surface in vertical setup for low contamination
    Local material removal is controlled by adjusting the dwell time
  • Verity Instrument
    End point detection for Etch, CMP and PR strip...

    • Application
    End point detection~ etch, ash, CVD etchback
    Fault detection & classification
    CVD film thickness
    plasma diagnostics
    Process development
    CMP endpoint
    In-line run to run
    PVD film thickness
    In-situ & real-time
    With or without plasma
    Features
    Optical emission spectrograph
    • Reflectometer, low cost bandpass filter
    • High resolution nanochromator
    • Providing advance algorithms such as neural PCA
    Neural Net, threshold and parallel sequences
    • Trend line communication with process tool
    • CH-2-CH matching capability
  • SET Corporation
    High accuracy automated flip chip bonder...

    • Application
    Chip-to-chip, chip-to-wafer bonding
    Advanced packaging, TSV, 3D interconnect
    Chip stacking, optoelectronic and photonic, RF, MOEMS, MEMS, MCM
    Features
    Bonding accuracy ±0.5um, 3σ
    Advanced laser leveling system
    Face up station
    Fluid dispenser
    Integrated chamber for gang reflow in a gas or vaccuum environment
    Gas confinement chamber for in-situ oxidation removal during bonding
    Cognex for patter recognition system
    Mass reflow, in-situ reflow, fluxless eutectic bonding
    Thermo-compression, ultrasonic bonding
    UV or thermal cured adhesive bonding
    UV-NIL and hot embossing lithography
    Force : 5N up to 4,000N
    Temperature range : RT 450°C, resolution 1°C

Categories

200 Equipment, Assembly
  • Die Bonding; Attach Equipment
  • Package Handling; Conveying Equipment
  • Wire Bonding Equipment
    • 202 Equipment, General Use
  • Heating; Annealing; Curing Equipment - Furnaces; Conveyors; Ovens; Test Chambers; Heat Treating
  • Vibration Isolation Systems
    • 203 Equipment, Inspection & Measurement
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Die Inspection; Die Shear
  • Microscopes: Atomic Force Microscopes (AFM)
  • Microscopes: Confocal Scanning Microscope; 3-D Video Microscopes
  • Microscopes: Optical Microscopes
  • Microscopes: Scanning Electron Microscope (SEM); Focused Ion Beam (FIB), Transmission Electron Micr
  • Overlay Measurement
  • Package Inspection; Lead Scanners
  • Thermal Sensing, Measurement, Analysis
    • 207 Equipment, Process
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Deposition; Physical Vapor (PVD); Sputtering; Evaporation Equipment
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Ion; E-Beam Milling Etching Equipment
    • 208 Equipment, Test
  • Probe Card Maintenance and Analysis Systems
    • 300 Materials, Assembly
  • Bonding; Interconnect Materials - Wire; Ribbon; Tape; Capillaries & Tools
    • 309 Materials, Test
  • Probe Cards; DUT boards and other probing accessories (incl Ceramic and Special Purpose Probe Cards)
    • 401 Sub-systems
  • Handling; Transfer; Loading Systems; Lifting devices
  • Pumps, Vacuum
  • Temperature Sensing; Control; Recirculators; Chillers; Heat Exchangers
    • 701 Manufacturing Services or Consulting
  • Clean Room; Contamination Control
  • Wafer Handling
    • Loading ...

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