02-531-7800

TECHNIC KOREA

Seoul, 
Korea (South)
http://www.technic.com
  • Booth: C244


Technic - Advanced Engineered Solutions for over 75 years

Technic showcases chemistry solutions for advanced semiconductor packaging. Marketed under the name Elevate, Technic’s electrodeposition chemistries are well respected for innovation and high quality in such applications as RDL, pillars, microbumps, and LED packaging. Technic also supplies several high-performance photoresist strippers for liquid and dryfilm resists, as well as a full range of metal etchants and cleaners marketed under the names, TechniStrip®, TechniEtch, and Techniclean.

For analytical controls, the Technic RTA 3D will be on display. The RTA has become the leading analytical control system for damascene copper processes and backend packaging applications for controlling TSV and copper pillar processes.


 Products

  • RTA 3D
    Real Time Analyzer 3D...

  • Technic’s Real Time Analyzer 3D version is the culmination of many years of field and lab experience by the RTA team. This system utilizes all the technology found in the well-established RTA system with additional features to increase reliability and robustness. The Technic RTA is the only commercially available automatic instrument that utilizes a combination of modern electrochemical techniques (Cyclic Voltammetry including) with state-of-the-art statistical (chemometric) approach.

    Features and Benefits

    • State-of-the-art of electronic components

    • Innovative electrochemical techniques

    • Intuitive Graphical User Interface

    • Design based on field experience and customer input

    • Virtually consumable free

    • Automatic temperature correction capabilities

    • Open software architecture allowing advanced for customization and integration

  • TechniStrip® NF52
    High Dissolution, High Metal Compatibility NMP-Free Photoresist Stripper...

  • TechniStrip® NF52 is formulated to provide powerful stripping performance on difficult to remove dryfilm photoresist and is the product of choice for many leading semiconductor manufacturers.

    Features

    • Dissolution on most commercial dryfilm photoresist • Dissolution of commercial spin-on photoresist (N & P Tones)
    • Extremely low etch rate on Cu, Ni, Au and other materials • Compatible with fragile III/V materials and organic substrates
    • High stripping rate of > 10 µm/minute
    • Long bath life
    • Proven performance on both batch (spray and immersion) and single-wafer toolsets

    Benefits

    • Reduced cost of operation achieved through a highly efficient process and longer bath life
    • Reduced defects by providing full dissolution on most dryfilm and liquid photoresist
    • High metal compatibility provides wider processing window and ease of operation
    • CMR free (carcinogenic, mutagenic or toxic for reproduction) formulation reduces safety risk to operators
  • Elevate Gold 7990 NBV
    Stable, Environmentally Friendly, and Versatile Elevate Gold 7990 NBV HT eliminates the inherent weaknesses of traditional sulfite gold processes. Because Elevate Gold 7990 NBV HT operates at a pH of 6.3, it is compatible with all photoresists...

  • Features

    • Very stable electrolyte
    • Low-stress deposit
    • Smooth, bright deposit without the use of harmful metallic grain refiners
    • Low deposit thickness variation across the wafer even with small and large features on the same die
    • Able to deposit 2 – 3 times more gold in vias compared to a standard sulfite gold process
    • Extended bath life of 4 – 5 metal turnovers in most applications
    • Currently in production around the world in high volume manufacturing

    Benefits

    • Reduced cost of operation through:
    1. Extended bath life which significantly reduces the number of bath makeups per year
    2. Stable electrolyte eliminates scrap produced from bath plate-out
    3. Excellent coplanarity and step coverage resulting in less gold used per wafer
    4. High-speed plating increases wafer production capabilities
    • Free of cyanide, thallium, and arsenic making it safe for operators and environmentally responsible.
    • For use in plating tools from manual wet bench and R&D to fully automatic production lines.
    • One of the most widely used and reliable sulfite gold chemistry in the semiconductor industry.
  • TechniEtch TBR19
    High-Performance Etchant TechniEtch TBR19 is a stabilized hydrogen peroxide based metal etchant that is extremely selective with a very low undercut value of < 0.2 microns...

  • Features

    • Excellent selectivity
    • Low undercut
    • Improved etch uniformity
    • Stable and consistent etch rate over the life of the bath
    • Fluoride-free aqueous solution
    • Compatible with most UBM and copper pillar integration materials
    • Fully compatible with aluminum
    • Tunable etch rate


    Benefits

    • High selectivity and low undercut provides high yields with fine pitch patterns
    • Reduced cost of operation through extended bath life
    • High process efficiency through stable chemistry and consistent etch rate
    • Wide process operating window – 50% process overetch still results in minimal undercut
  • TechniEtch CN10
    TechniEtchCN10 is a highly tunable, effective and selective metal etchant for UBM, RDL and copper pillar applications. The solution is an acidic based metal etchant containing specific additives that greatly enhance stability and metal loading capability....

  • FEATURES AND BENEFITS

    1. Better process controllability/reliability.

    - Tunable etch rate by varying H2O2 concentration
    - Selectivity Cu/Ni up to 1/6
    - High etch rate at room temperature.

    2. High stability even in presence of metal contamination
    - Profile and process control enhanced with the CN10 formulation additives compared to standard peroxide- acid approach.

    3. Loading & bath life independent of the solution loading

  • TechniClean CA25
    TechniClean CA25 is a semi-aqueous proprietary blend that has been formulated to address post etch residue (PER) removal for all interconnect and technology nodes....

  •  FEATURES AND BENEFITS

    1. Unmatched PER cleaning versatility

    2. Proficient on various metal stacks, features and designs

    3. High cleaning efficiency at low temperature

    4. No intermediate rinse

    5. Low environmental impact (fluoride, amine, hydroxylamine and catechol free)

    6. Reduced processing time