TECHNIC KOREA

Technic’s Real Time Analyzer 3D version is the culmination of many years of field and lab experience by the RTA team. This system utilizes all the technology found in the well-established RTA system with additional features to increase reliability and robustness. The Technic RTA is the only commercially available automatic instrument that utilizes a combination of modern electrochemical techniques (Cyclic Voltammetry including) with state-of-the-art statistical (chemometric) approach.

Features and Benefits

• State-of-the-art of electronic components

• Innovative electrochemical techniques

• Intuitive Graphical User Interface

• Design based on field experience and customer input

• Virtually consumable free

• Automatic temperature correction capabilities

• Open software architecture allowing advanced for customization and integration

TechniStrip® NF52 is formulated to provide powerful stripping performance on difficult to remove dryfilm photoresist and is the product of choice for many leading semiconductor manufacturers.

Features

• Dissolution on most commercial dryfilm photoresist • Dissolution of commercial spin-on photoresist (N & P Tones)
• Extremely low etch rate on Cu, Ni, Au and other materials • Compatible with fragile III/V materials and organic substrates
• High stripping rate of > 10 µm/minute
• Long bath life
• Proven performance on both batch (spray and immersion) and single-wafer toolsets

Benefits

• Reduced cost of operation achieved through a highly efficient process and longer bath life
• Reduced defects by providing full dissolution on most dryfilm and liquid photoresist
• High metal compatibility provides wider processing window and ease of operation
• CMR free (carcinogenic, mutagenic or toxic for reproduction) formulation reduces safety risk to operators

Features

• Very stable electrolyte
• Low-stress deposit
• Smooth, bright deposit without the use of harmful metallic grain refiners
• Low deposit thickness variation across the wafer even with small and large features on the same die
• Able to deposit 2 – 3 times more gold in vias compared to a standard sulfite gold process
• Extended bath life of 4 – 5 metal turnovers in most applications
• Currently in production around the world in high volume manufacturing

Benefits

• Reduced cost of operation through:

1. Extended bath life which significantly reduces the number of bath makeups per year
2. Stable electrolyte eliminates scrap produced from bath plate-out
3. Excellent coplanarity and step coverage resulting in less gold used per wafer
4. High-speed plating increases wafer production capabilities

• Free of cyanide, thallium, and arsenic making it safe for operators and environmentally responsible.
• For use in plating tools from manual wet bench and R&D to fully automatic production lines.
• One of the most widely used and reliable sulfite gold chemistry in the semiconductor industry.

Features

• Excellent selectivity
• Low undercut
• Improved etch uniformity
• Stable and consistent etch rate over the life of the bath
• Fluoride-free aqueous solution
• Compatible with most UBM and copper pillar integration materials
• Fully compatible with aluminum
• Tunable etch rate

Benefits

• High selectivity and low undercut provides high yields with fine pitch patterns
• Reduced cost of operation through extended bath life
• High process efficiency through stable chemistry and consistent etch rate
• Wide process operating window – 50% process overetch still results in minimal undercut

FEATURES AND BENEFITS

1. Better process controllability/reliability.

- Tunable etch rate by varying H2O2 concentration
- Selectivity Cu/Ni up to 1/6
- High etch rate at room temperature.

2. High stability even in presence of metal contamination
- Profile and process control enhanced with the CN10 formulation additives compared to standard peroxide- acid approach.

3. Loading & bath life independent of the solution loading

 FEATURES AND BENEFITS

1. Unmatched PER cleaning versatility

2. Proficient on various metal stacks, features and designs

3. High cleaning efficiency at low temperature

4. No intermediate rinse

5. Low environmental impact (fluoride, amine, hydroxylamine and catechol free)

6. Reduced processing time