Toray Engineering Co., Ltd.

Seongnam-si,  Gyeonggi-do 
Korea (South)
http://www.tekor.co.kr
  • Booth: D904

Welcome to Toray Engineering /TEK Korea Booth.

Toray engineering propose total solution in the semiconductor and FPD manufacturing with original manufacturing device, inspection device and analysis device.1.Wafer pattern inspection, 2.Flip chip bonder,3.Bonder for embedded packaging,4.Vacuum printing encapsulation system,5.TSC Coater.6.Zirconia Type Oxygen Gas Analyzer.

Categories

200 Equipment, Assembly
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Molding; Encapsulation; Decapsulation Equipment
  • Wafer Level Bonders
    • 201 Equipment, Flat Panel Display
  • Alignment Film Coating Equipment
  • Color Pattern Processing Equipment
    • 202 Equipment, General Use
  • Lamination; Sheet Laminating Equipment
    • 203 Equipment, Inspection & Measurement
  • Die Inspection; Die Shear
    • 204 Equipment, Mems
  • Wafer Level Bonders
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