TSE Co., Ltd.

Cheonan-si, 
Korea (South)
http://www.tse21.com
  • Booth: A704


TSE has been grown up with semiconductor industries since TSE was founded in 1994. TSE has developed test interface system, load board, test socket and probe card which are necessary for semiconductor test and has supplied to semiconductor chip makers worldwide. Moreover, TSE has creates true value together with the customers by developing various types of TOB( Tester On Board) which improve the performance of existing ATE system.
TSE operates MEMS production line, and produces wide range of products. the product items are MEMS Probe Card, MRC(MEMS Rubber Socket), OLED MEMS Unit, MEMS Inductor, MEMS Relay, etc.
TSE supplies load board and test sockets required for SoC and Logic semiconductor devices, but also supplies handler equipment.
Based on those technologies, TSE contributes all our effort continuously to be a company to create new value consistently together with customers. We ask you a favor of your warm support and interest to TSE which makes a new take-off.

 Products

  • Probe Card (HPC)
    HPC (High Performance Probe Card)...

    • > High parallelism test solution up to 2,000para

    > Pin count up to 60,000pins

    > Automatic Probe bonding

  • Load Board
    Load board is an interface board to test SOC package such as CPU, Chipset, GPU and AP. TSE is providing high speed, high performance load board to the major semiconductor customers like Intel, Samsung and AMD in worldwide....

    • > V93K 769BGA Dual Site Final Test Load Board (Picture)

    > ATE design library - V93K, T2000, Ultraflex, J750 and many more testers.

    > Accumulated PCB design know-how for 25 years and SI/PI simulation capability

    > TSE has owned PCB Fab and ass'y and test line in house.

    > TSE provides load board including stiffener frame and test socket as a turnkey solution.

  • TF MLO
    Fine pitch solution - C4 80um Pad (Bump) pitch. Mems Technology Thin film Stack up Process. Short delivery and Turn Key solutions for Vertical Probe card....

    • > C4 Pad Pitch : 80um

    > Thickness : 1T // 1.5T // 2.5T

    > Layer : Thinfilm 3 layer + MLO 6 layers

    > Mems Technology Thin film Stackup process

    > Short delivery than conventional MLO

    > TurnKey Solution (Design +PCB FAB+MLO FAB+Probe Card assembly)

  • Extreme Temperature TIB (Test Interface Board)
    Extreme Temperature TIB(Test Interface Board) TSE Interface board specialized in Extreme Temperature Package Test....

    • Extreme Temperature Test has been required in the Memory Test Envoironment.

    TSE has developed our own specialized Interface Board System for Extreme Temperature Pacakge Test.

    Extreme Temperature TIB(Test Interface Board)

    -. Extreme temperature Connector developed

    -. Docking Epoxy Frame Material developed

    -. Direct Cooling Interface Board developed

    > Coolant, Direct Active IC Cooling

    > Component Antioxidants

    > Temp. Reduced stabilization time

  • V93K Direct Docking Mems Probe card
    Improve CCC than conventional Cobra Probe! Good reliability probing planarity as Mems technology. Various Direct docking wafer probing solutions!...

    • > Probe : MEMS Cobra Pin (60x60um Cobra type)

    > Contact force : 1.2gF/mil

    > CCC : 950mA

    > Square hole type Housing (70x70um)

    > Life time 1,5kk

    > Direct docking solution (V93K, Uflex)

    > Easy Replacement and Repair

    > Turn key Solution (PCB+MLO+Probe Head assembly)

  • Probe Card PCB
    High Performance Probe Card ...

    • > Layer : 136 / diameter : 480 / thickness : 7.55

    > Materials : EM-888

    > Blind Via Hole

Categories

208 Equipment, Test
  • Handlers; Positioner Systems
  • Logic Test Systems
  • Memory Test Systems
  • Optical Test Systems
  • Package Test Systems
  • Probe Card Maintenance and Analysis Systems
  • System on a Chip (SOC); Mixed Signal Test Systems
    • 309 Materials, Test
  • Burn-In Boards; Performance Boards (incl. Low; High Temp and Ceramic)
  • Probe Cards; DUT boards and other probing accessories (incl Ceramic and Special Purpose Probe Cards)
  • Test Sockets; Contactors and Contact accessories
    • 902 Other
  • Other
    • 903 LED
  • LED Manufacturing Material and testing Instruments
  • OLED Related Equipment and Materials, Panel and Module
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