EV Group Korea Ltd.

Vertical stacking of semiconductor devices has become an increasingly viable approach to enabling continuous improvements in device density and performance. Wafer-to-wafer bonding is an essential process step to enable 3D stacked devices. EVG's GEMINI FB XT integrated fusion bonding system extends current standards and combines higher productivity with improved alignment and overlay accuracy for applications such as memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning. The system features the new SmartView NT3 bond aligner, developed specifically for fusion and hybrid wafer bonding alignment requirements of < 50 nm.

Features

• • New SmartView® NT3 face-to-face bond aligner with sub 50 nm wafer-to-wafer alignment accuracy
  • Up to six pre-processing modules like:
    • Clean module
    • LowTemp™ plasma activation module
    • Alignment verification module
    • Debond module
  • XT Frame concept for highest throughput with EFEM (Equipment Frontend Module)
  • Optional features:
    • Debond module
    • Thermocompression bond module

Known for its automation flexibility and reliability, the EVG6200 NT provides state-of-the-art mask alignment technology on a minimized footprint area combined with the utmost throughput, advanced alignment features and optimized total cost of ownership. Operator-friendly software, minimized time for mask and tooling changes, as well as efficient worldwide service and support makes it the ideal solution for any manufacturing environment. The EVG6200 NT or the fully-housed EVG6200 NT Gen2 mask alignment systems are available in semi-automated or automated configuration and equipped with integrated vibration isolation to achieve excellent exposure results for a wide range of applications, such as exposure of thin and thick resists, patterning of deep cavities and comparable topographies, as well as processing of thin and fragile materials such as compound semiconductors. Furthermore, the EVG’s proprietary SmartNIL technology is supported on both semi-automated and fully automated system configurations.

Features

• Wafer/substrate size from pieces up to 200 mm/8’’
• System design supporting versatility of lithography processes
• Throughput up to 180 WPH in first print mode or up to 140 WPH in automatic alignment mode
• Fragile, thin or warped wafer handling of multiple wafer sizes with quick change-over time
• Automated contact-free wedge compensation sequence with proximity spacers
• Auto origin function for precise centering of alignment key
• Dynamic alignment function featuring real-time offset correction
• Supports the latest UV-LED technology
• Rework sorting wafer management and flexible cassette system
• Manual substrate loading capability on automated system
• Field upgradeable from semi-automated to fully automated version
• Minimized system footprint and facility requirements
• Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
• Advanced Software features and compatibility between R&D and full-scale production
• Agile processing and conversion re-tooling
• Remote tech support & SECS/GEM compatibility
• Table top or stand-alone version with anti-vibration granite table
• Additional capabilities:
  • Bond alignment
  • IR alignment
  • Nanoimprint lithography (NIL)

FeaturesThe EVG520 IS single-chamber unit handles wafers up to 200 mm with semi-automated operation for small-volume-production applications. Redesigned based on customer feedback and EV Group's continuous technological innovations, the EVG520 IS features EV Group's proprietary symmetric rapid heating and cooling chuck design. Advantages such as independent top- and bottom-side heater, high-pressure-bonding capability, and the same material and process flexibility as on manual systems contribute to the success of all wafer bonding processes.

Features