YC

Characteristics
1.Chooses a platform that enables flexible selection of operating frequency, degree of precision of DC, and the throughput
(1)Expands operating frequency to enable the testing of maximum 1,536 memory devices per test head (I/O Shared) and allows for the extension of the pin numbers

(2)With unit expansion, its capacity can be upgraded to the level of MT6133

2.Supports processes for major memory device wafer test
In response to NAND Flash, DRAM, NOR Flash, etc.

3.In response to low cost/low power
Reduced price and power use through the optimal unit composition

Characteristics
1.Responds to high-cost performance and the manufacturing of multi-product memories
(1)For every test head, 3,072 memory devices can be simultaneously measured,
and the test head can independently start the test, so the test of the memory product can be optimized

(2)For every test head, the test of different products is possible and thus optimized for multi-type production

2.Supports the wafer test processes of all memory devices
(1)In response to all memory products including DRAM, NAND Flash, NOR Flash, SRAM, MCP, etc.

(2)With wafer test, responds to Known Good Die (KGD)

3.In response to low power
With the use of the latest device and the effect use of electric power, 30% of electricity use can be reduced

4.Brings convenience of the user
With the user interface (AViPS) in case of GUI, the development and analysis times of the test Program can be reduced