AP SYSTEMS CORPORATION

The KORONA™ PECVD-En System protects u-OLED devices from moisture and oxygen by the TFE (Thin Film Encapsulation) process. The ‘Inorganic Single Layer’ and the ‘Organic Layer’ are sequentially stacked to protect the u-OLED device. The KORONA™ PECVD-En system stacks the ‘Inorganic Single Layer’ in the TFE.

WVTR (Water Vaper Transmission Rate) and Transmittance are both important indicators in the TFE. The KORONA™ PECVD-En System is field-proven in both 8 inch and 12inch high-volume-manufacturing customer facilities.

AP Systems holds the capability for Research & Development meeting our customers’ needs to manufacture ‘u-OLED’, best suited display for VR headsets.

The KORONA™ DSC600/DSC200 is a plasma based system removing ‘scum’ after the lithography. The system delivers improvement in contact resistance value from the plating process and implements superior bump shapes.

The Descums Plasma process allows changing surface properties from hydrophobic to hydrophilic, improving the adhesion of the metal film in the   subsequent process. Among the Fan-out technologies that have recently become significant in the packaging process, improving surface properties in the RDL Process is essential by the Descum system.
 

AP Systems field-proven Descum equipment for 8-inch & 12-inch wafers and the PLP (up to 600mm) are currently available.

The KORONA™-RTP (Rapid Thermal Process) series is a solution for implant, anneal, spike, and oxidation. Exposing wafers at high temperatures in a short period of time, the Rapid Thermal Process significantly reduces thermal budgets using halogen lamps.

AP Systems KORONA™-RTP series provides excellent temperature uniformity, wafer rotation, radiation compensation, and intelligent temperature control. In addition, its in-house developed software allows optimizations according to the customers preference.

The KORONA™-RTP series has an installation base of more than 150 systems in Samsung Electronics, the World’s No.1 DRAM/NAND manufacturer. Based on its field-proven background, it has successfully entered overseas markets starting with China since 2020.

The KORONA™ PVD600 System is a metal deposition Sputter for the flip-chip technology packaging process. A solution for the metallization of both input and output signal transmissions under the bump.

The PVD600 System provides superior thin metal film deposition, by its in-situ process sequence starting with the Multi-Degas chamber (A multi slot chamber capable of ‘out gassing’), the CCP Type Plasma Cleaning Chamber (Eliminates oxide film uniformly) and to the thin metal film (Ti & Cu) deposition chamber.

Its extended preventive maintenance interval and specifically designed ‘quick back-up’ system lowers maintenance costs, while delivering the highest productivity by its specialized wafer flow sequence and verified pasting process control.

Apart from the UBM KORONA™ PVD600, the FoPLP Sputter and u-bump metal deposition Sputter for the TSV process are also available. Sputters for the FoWLP will be ready at 2023.