CHANGZHOU MINGSEAL ROBOT TECHNOLOGY CO., LTD.

The PJS-100 Jetting Dispensing System is a piezoelectric product with state-of-the-art technology and reliability. 
The system can be used extensively in contactless work areas in advanced semiconductor manufacturing and 
smartphone parts manufacturing.

The PJS-100 Jetting Dispensing System is a piezoelectric product with state-of-the-art technology and reliability. The system can be used extensively in contactless work areas in advanced semiconductor manufacturing and smartphone parts manufacturing.

It can also dispense various types of fluids such as solder paste, silver paste, hot melt, anaerobic adhesive, and UV adhesive.

And if you use the piezo jetting dispenser with the automatic line, it can be continuously produced at high speed, so the manufacturing cost can be reduced.

It's a system that can be saved.

VS300 has the servo motor and lead screw system, the system's, high precision, high speed, high efficiency and high consistency can be guaranteed.
The platform’s repositioning accuracy can reach 0.01mm; matched with self-developed pneumatic controller or piezoekctric jetting valve, the fluid’s high-precision dispensing and track’s precise control can be achieved.
Non-contact type dispensing, which can achieve 0.25mm stable glue line width or glue dot did. in dispensing.

It is safety with a repetitive positioning precision of 0.01 mm or less, the self-developed pneumatic dispenser or the piezoelectric jet dispenser is applied to ensure the extremely precise discharge and stable control of fluids.

and the noncontact dispenser can dispense fluids with a line width or diameter of 250 ㎛.

Various modules can be optional: Intelligent vision recognition, LDS module, automatic tip calibration, in-line type UV curing, liquid level detection, etc.

Finally, Unique dispensing process module, compatible in blowing and suction for valve automatic cleaning, to efficiently avoid the glue’s hanging.

FS600 is a high-speed, high-precision, full-automatic dispensing system developed based on the latest dispensing process requirements for 3C components, final assembly, SMT areas. This equipment uses marble frame structure, linear-motor driving system, and piezoelectric jetting valve, etc. All configurations can meet the increasingly demanding dispensing process and system stability requirements.

MES real-time docking, to real-time upload the production status information, and give alarm when system in abnormal condition.

Mainly applicable to the wafer/chip's 1st level packaging under-fill, overfill, edge-bond, and SMTs 2nd level under-fill, en-cap, overfill, etc