Bonding accuracy ±0.5um, 3σ
Advanced laser leveling system
Integrated chamber for gang reflow in a gas or vaccuum environment
Gas confinement chamber for in-situ oxidation removal during bonding
Cognex for patter recognition system
Mass reflow, in-situ reflow, fluxless eutectic bonding
Thermo-compression, ultrasonic bonding
UV or thermal cured adhesive bonding
UV-NIL and hot embossing lithography
Temperature range : RT 450°C, resolution 1°C