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Exhibit
Jan 31- Feb 2, 2018
COEX
Seoul, Korea
Genesem Inc.
Incheon,
Korea
Korea (South)
http://www.genesem.com
Booth: C336
Categories
200 Equipment, Assembly
Ball Placement; Attach Systems
Cleaning; Washing Equipment for Assembly & Packaging
Cut & Down Set; Trim; Form Equipment
Die Bonding; Attach Equipment
Die Sorter; Pick & Place; Flip Chip Placement Systems
Dispensing Systems
Lead Frame Taping Systems
Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
Marking; Imprinting; Labeling Equipment
Molding; Encapsulation; Decapsulation Equipment
Package Handling; Conveying Equipment
202 Equipment, General Use
Lamination; Sheet Laminating Equipment
206 PV Equipment
Cells
Modules
Wafers
207 Equipment, Process
Bumping Systems
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Appointment Date*
Wednesday, Feb 01 2023
Thursday, Feb 02 2023
Friday, Feb 03 2023
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Wed Feb, 01
Thu Feb, 02
Fri Feb, 03
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