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OTSUKA ELECTRONICS KOREA CO., LTD.

Seongnam-si,  Gyeonggi-do 
Korea (South)
https://otsukael.co.kr/
  • Booth: B717


Hi, we are Otsuka Electronics Korea Co., Ltd.

With highly advanced optical technology,
Otsuka Electronics develops and provides measurement devices and optoelectrical testing systems

Otsuka Electronics Korea was established in 2003 and has grown as an independent R&D company. Now we are one of the world leaders making hundreds of contracts every year and exporting products worldwide.

We are constantly introducing innovative and creative products to contribute to the growth of the high-tech industry focusing on what we do and what we can achieve only as Otsuka-people.

 Products

  • SF-3 | Si wafer thickness monitoring system
    SF-3 saves time and costs for quality inspection by performing thickness inspection in real-time during the processing of semiconductors or films....

    • To see in detail: https://otsukael.co.kr/semiconductor-sf3

     Features 

    • It is a non-contact, non-destructive thickness measurement method using optics

    • In the case of silicon, thickness measurements from 6 to 1300 μm are possible

    • Parameters can be set after spectrum analysis

    • It uses proprietary analytical engine technology and algorithms

    • The automatic mapping function is available to measure the thickness distribution

    • It measures the thickness of multi-layered and  each layer of temporary wafers

    • High-speed real-time monitoring - max. 60,000 points per 1 min - is possible during CMP, BG, and Final polishing(TTV, GBIR)

     Specifications 

    Model SF-3/200 SF-3/300 SF-3/800 SF-3/1300
    Silicon meas. thickness range 6 ~ 400μm 10 ~ 775μm 20 ~ 1,000μm 50 ~ 1,300μm
    Resin meas. thickness range 10 ~ 1,000μm 20 ~ 1,500μm 40 ~ 2,000μm 1,000 ~ 2,600μm
    Minimum sampling period 5kHz(200μsec.)
    Repeatability *less than ± 0.01%
    Measurement size **over about Φ20μm
    Measurement distance 50mm, 80mm, 120mm, 150mm, 200mm
    Light source semiconductor light source(laser class 3B product)
    Analysis method FFT analysis
    Interface LAN, I/O input/output terminal
    Power supply DC 24V specification(AC power supply unit sold separately)
    Size 123(W) x 224(D) x 128(H)mm
    Optional item other lengths of probes, AC power, aluminum reference, measured light detection target, fiber cleaner

    *the standard relative deviation of our standard sample AirGap(approx.1,000μm) at time of measurement(n=20)

    **design value at time of WD 80mm probe specification

     Measurement 

    Measurement item

    • Film thickness analysis(max. 5 layers)

     Applications 

    • Thickness measurement for Si wafer material

    • Air gap size

    • Grinding evaluation for silicon / compound semiconductor

    • 1.3mm / next-generation 450mm wafer

    • 775㎛ 300mm wafer

    • TSV wafer(Si layer thickness measurement on via)

    • Other materials(SiO2, film)

  • OPTM(UV SR) | Microscopic spectro-photometer
    Advances in technology have made the role of nanomaterials even more important. The OPTM series enable microscopic measurement and study than conventional products...

    • To see in detail: https://otsukael.co.kr/semiconductor-optm

     Features 

    • High-precision absolute reflectance measurement by microscopic spectroscopy (Multilayer film thickness, optical constant)
    • The functions for film thickness measurement are integrated into the head
    • An optical system that measures a wide wavelength range from UV to NIR
    • Non-contact, non-destructive high-speed micro measurement within 1 second per point
    • Safety mechanism guaranteed by the area sensor
    • A wizard function provided for beginners which enables optical constant analysis
    • Even complex optical constants can be analyzed using Multipoint analysis method
    • A macro function included that allows you to set the measurement sequence
    • A 300mm size stage can be equipped
    • It is customizable

     Specifications 

    Models

    Wavelength range Automatic XY stage type Fixed frame type Built-in head type
    230 ~ 800nm OPTM-A1 OPTM-F1 OPTM-H1
    360 ~ 1,100nm OPTM-A2 OPTM-F2 OPTM-H2
    900 ~ 1,600nm OPTM-A3 OPTM-F3 OPTM-H3

    Specifications Stroke Repeatability Stroke resolution
    Automatic XY stage type X: 200mm, Y: 225mm 2μm 1μm

    Specification selections(choose one for each item)

    Wavelength range Film thickness meas. range Detector Light source
    230 ~ 800nm 1nm ~ 35μm CCD deuterium + halogen
    360 ~ 1,100nm 7nm ~ 49μm CCD deuterium + halogen
    900 ~ 1,600nm 16nm ~ 92μm InGaAs halogen

    Type Magnification Measurement spot diameter Viewing field
    Reflective objective type 2x lens ∅ 100μm ∅ 4,000μm
    10x lens ∅ 20μm ∅ 800μm
    20x lens ∅ 10μm ∅ 400μm
    40x lens ∅ 5μm ∅ 200μm
    Visible refractive type 5x lens ∅ 40μm ∅ 1,600μm

     Measurement 

    Measurement items

    • Reflectance(absolute, relative)

    • Thickness(from Å to ㎛)

    • Optical constant(n, k)

    Measurable samples

    • Evaporated film for semiconductor/display fabrication

    • Coated film on PET or flexible substrate

    • Laminate film of transparent materials

  • GS-300 | Load port compatible film thickness meas.
    Identifying any defect or loss on a wafer immediate is a critical part of labs and manufacturers. GS-300 helps Si wafer measurement in real-time and understanding the wafer characteristics at a glance by visualizing the results in a color-coded grid...

    • To see in detail: https://otsukael.co.kr/gs300

     Features 

    • Compatible with the spare unit of Φ300mm EFEM port

    • Achieves pattern alignment of wiring patterns embedded in wafers

    • Responds to high throughput requirements of semiconductor process

    • Supports high precision notch alignment function
    • Minimized size allows installation in small spaces

     Specifications 

    Type Integration mapping system
    Stage type RθXY stage
    Measurement system microscope head + IR camera
    Max. wafer size Φ300mm
    Wafer angle correction function O
    Pattern alignment function O
    Wafer thickness range SF-3 thickness sensor specification
    Size 500(W) x 500(D) x 1680(H)mm (monitor and keyboard are not included)


     Measurement 

    Measurable samples(example)

    • Silicon thickness after grinding TSV embedded pattern wafer
    • Φ300mm thickness wafer
  • ELSZ | Particle size, zeta potential, mw analyzer
    ELSZneo is a master product measuring not only the particle size and molecular weight but zeta potential from dilute solution to concentrated solution...

    • To see in detail: https://otsukael.co.kr/elszneo

     Features (*option)

    • It measures particle size and zeta potential in a wide concentration range from dilute to a concentrated solution (~ 40%)

    • Multi-angle measurement enables measurement of particle size distribution with high resolution

    • Zeta potential of the flat sample can be measured under a hypersaline environment

    • Particle concentration can be measured using the static light scattering method

    • Microrheology measurement is possible by the dynamic light scattering method

    • It is possible to evaluate the network structure and non-uniformity of the gel by measuring multiple points of the gel sample

    • Continuous measurement of particle size and zeta potential is possible with a standard flow cell

    • It has a wide temperature range between 0 and 90℃

    • Degeneration, phase transition temperature analysis of proteins, etc. are possible by the temperature gradient function

    • It provides highly precise zeta potential measurement results by measuring the electro-osmosis flow and plot analysis in the cell

    • *Fluorescent cut filter can be attached

     Specifications 

    Measurement
    principle    		 particle size dynamic light scattering method (photon correlation method)
    zeta potential electrophoretic light scattering method (laser doppler method)
    molecular weight static light scattering method
    Optical
    system    		 particle size homodyne optical system
    zeta potential heterodyne optical system
    molecular weight homodyne optical system
    Light source high power semiconductor laser
    Detector high sensitivity APD
    Cell unit standard flow cell unit(zeta potential/particle size)
    particle size cell unit(particle size)
    Particle size multi-angle cell unit(particle size, molecular weight)
    Temperature 0 to 90℃ (with gradient function)
    Power supply 100V±10%, 250VA
    Size and weight 330(W) x 565(D) x 245(H)mm, approx. 22kg

     Measurement 

    Measurement items

    • Molecular weight
    • Particle size
    • Zeta potential
    • Particle concentration
    • Microrheology
    • Gel network structure

    Molecular weight 340 ~ 2,000x10^4
    Particle size 0.1 ~ 10,000nm
    Mobility -20x10^-4 ~ 20x10^-4cm²/V·s
    Zeta potential no limitation

    Measurement range

    Temperature 0 ~ 90℃
    Concentration

    *particle size: 0.00001%(0.1ppm) ~ 40%, zeta potential: 0.001% ~ 40%

    *Latex 112nm: 0.00001 ~ 10%, Taurocholic acid: ~ 40%

     Applications 

    Ideal for basic and applied research in surface chemistry, inorganic materials, semiconductors, polymers, biology, pharmacy, medicine, and other fields that handle not only fine particles but also the surface science of films and flat samples.

    • New functional material
      - Fuel cell(carbon nanotube, fullerene, function film, catalyst, nano-metal)
      - Bionanotechnology(nano capsule, dendrimer, DDS), nanobubble

    • Ceramic and paints
      - Ceramic(silica, alumina, TiO2)
      - Surface modifier, dispersion and cohesion of inorganic sol
      - Dispersion and cohesion of carbon black and organic pigment
      - Slurry state sample
      - Color filter
      - Flotation adsorption research

    • Semiconductor
      - Alien objects research on silicon wafer
      - Interaction research of abrasive/additive on wafer surface
      - CMP slurry

    • Polymer and chemical
      - Emulsion dispersion and cohesion
      - Surface modifier of latex
      - Function research of polyelectrolyte
      - Process control of paper production and pulp additive research

    • Pharmaceutical and food
      - Emulsion dispersion and cohesion
      - Dispersion/cohesion control of liposome and vesicle
      - Functionality of surfactant(Micelle)

  • UC-31M | Uniformity Inspection Camera
    UC-31M uses high-pixel CCD image sensors to completely and quickly measure optimized optical properties...

    • To see in detail: https://otsukael.co.kr/display-hs1000h

     Features 

    • High speed; suitable for a manufacturing process

    • Determination of silicon omission, damage, and uniformity of MiniLED

    • Sample measurement from smartphones to wide TV screens. (FOV, WD)

    • Compatible with various display types. (LCD, OLED, micro LED, mini LED)

    • Responds retroactively to national weighing standards. (KOLAS)

     Core technologies 

    Customizable responding to customer product characteristics and manufacturing lines

    • Ultra-low/high-brightness optimization

    • Active Area Detection (High performance ROI identification function)

    • Tact time optimization

    • Calibration available at a production line

    Sample measurement in various size: small and large display, μLED, mini LED,OLED

Categories

203 Equipment, Inspection & Measurement
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Fiber Optic Inspection Instruments
  • Film Thickness; Thickness; Uniformity Measurement; Ellipsometer
  • Flat; Notch Finding System
  • Instruments; Bench Top Test
  • Resistivity Measurement; 4 point probe; Sheet resistance
  • Spectrometers; Fourier Transform Infrared (FTIR); Attenuated Total Reflectance FTIR (ATR-FTIR); Auge
  • Stress; Refractive Index; Reflectivity & Conductivity Measurement
  • Wafer; Substrate Metrology; Topology; Nanotopography; Flatness Measurement; Crystalline Orientation
    • 206 PV Equipment
  • Inspection and Metrology
    • 208 Equipment, Test
  • FPD Test; Measurement; Repair Equipment
    • 700 Manufacturing Services
  • Calibration & Reference Standards
  • Measurement; Inspection Service
    • 903 LED
  • FPD Inspection Equipment, Materials and Parts


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