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MSPC Korea

Hwaseong, Gyeonggi-do,  Korea (South)
https://www.tsi.com/msp
  • Booth: A842

MSP™, a Division of TSI®, greets you at SEMICON Korea 2024!

Overview

Welcome to MSP at SEMICON Korea 2023!
We proudly showcase our pioneering solutions in semiconductor production.

  • MSP Turbo II™ Vaporizers: Merging advanced droplet vaporization and direct liquid injection, we guarantee precision and uniformity.
  • Excellence in Thin Films: With MSP Turbo II™ Vaporizers, achieve peak wafer yields and top-tier thin-film quality.
  • Liquid Flow Controllers: Ideal for PE vaporizers and ALD, ensuring optimal liquid flow.
  • 2300G3 Particle Deposition System: The gold standard in wafer inspection and metrology, raising the bar for device yield.

With MSP, you're assured of top-notch vaporization solutions and cutting-edge technology to cover your comprehensive particle and calibration needs.
Explore our booth and see how our innovations are influencing the development of the industry. Join us in envisioning the future at SEMICON Korea 2023. http://tsi.com/msp


  Press Releases

  • MSP, a Division of TSI®, is thrilled to announce the launch of the new line of MSP Turbo II™ Vaporizers. Engineered for chemical vapor deposition (CVD) and atomic layer deposition (ALD) applications in semiconductor device fabrication and industrial coatings, these revolutionary vaporizers are suitable for a wide range of liquid precursors, even thermally sensitive and low vapor pressure liquids.

    Twice the Output, Half the Size

    Inspired by breakthroughs in the science of droplet atomization and evaporation, these innovative vaporizers are half the physical footprint of earlier versions, while delivering a staggering 200% increase in vapor output.

    “Innovation in heat transfer efficiency, combined with optimization of droplet atomization has resulted in the ability to drive higher vapor outputs, while still ensuring highly stable and reliable concentration profiles,” said Darrick Niccum, President of MSP. “This technology can increase throughput while simultaneously improving process repeatability. The optimized design also reduces downtime, which leads to significantly lower total cost of ownership (TCO) in semiconductor process tools.”

    Higher vapor concentrations and fast vapor stabilization rates enable faster deposition and etch times, reducing both wafer processing time and liquid waste. This, combined with a long lifetime and low maintenance requirements, results in significant cost savings over the life of the equipment or system.

    Pioneering Vaporization Solutions

    Elevate your CVD and ALD processes to unparalleled heights with the MSP Turbo II™ Vaporizers. For further information or to request your Turbo II™ Vaporizer, visit tsi.com/MSP-Turbo-II/ or contact our sales team.


    About MSP, a Division of TSI®

    Used in microelectronic fabs world-wide, MSP offers a variety of different direct liquid injection (DLI) vaporizers along with VPG filters and liquid flow controllers. MSP also provides a range of semiconductor metrology equipment, including particle deposition systemscontamination standard wafers and reticles, and particle size standards.

    For more information on MSP, visit our website: www.tsi.com/msp. For more information on TSI Incorporated, visit our website: www.tsi.com, visit our page on Facebook: www.facebook.com/TSIIncorporated, or follow us on X (formerly known as Twitter): www.twitter.com/TSIIncorporated.


  Products

  • Low-Flow Turbo II Vaporizer 2852NP
    MSP's Turbo II™ Vaporizer 2852NP is designed for applications that require low to mid vapor flow rates....

  • Based off of the field proven, highly reliable, and low-maintenance MSP Turbo™ Vaporizers, the new 2852NP provides stable vapor concentrations while maintaining a very small footprint. The 2852NP also has a liquid shut-off valve, and can be used with any liquid flow controller that has an integrated flow control valve.

    Dimensions (HxWxD)

    198 mm x 79 mm x 114 mm (7.8 inch x 3.1 inch x 4.5 inch)

    Weight 2.5 kg (5.6 lb)
    Fittings (on the unit) Carrier Gas Inlet 1/4 in. VCR female split nut
    Liquid Inlet 1/8 in. VCR female
    Vapor Outlet 1/4 in. VCR female split nut
    Compressed Air 4 mm instant tube fitting
    Wetted Parts SS 316, PEEK, PTFE, Elgiloy®, FFKM
    Leak Integrity ≤ 1x 10-8 Pa·m3/s Helium
    Heater Power Requirements1 208 VAC, 60 Hz, 450 W
    Carrier Gas Inert gas recommended
    Max Carrier Gas Flow1 2.0 standard liters/min N2 @ 50 psig
    Max Liquid Flow2 7 g/min (TEOS or equivalent)
    System Pressure Limit 150 psig
    Compressed Air 90 to 110 psig
    Temperature Range3 40°C to 180°C
    Temperature Sensor 2 type Ƙ thermocouples

    Specifications subject to change without notice.

    Max Carrier Flow, Heater Power (W) and Line Voltage are factory adjustable, visit www.tsi.com/contact to request more information.
    Max. liquid flow is process dependent. The spec assumes a vaporizer temperature of 180°C, max. carrier gas flow and pressure <50 Torr immediately downstream of the vaporizer.
    Appropriate venting is required.

  • Low-Flow Turbo II Vaporizer 2852PE
    MSP's Turbo II™ Vaporizer 2852PE is designed for high-precision microelectronic applications that require low to mid vapor flow rates....

  • Based off of the field proven, highly reliable, and low maintenance MSP Turbo™ Vaporizers, the new 2852PE provides stable vapor concentrations while maintaining a very small footprint. The 2852PE also features an on-board flow control valve for extremely fast flow-rate response.

    Dimensions (HxWxD)

    198 mm x 79 mm x 114 mm (7.8 inch x 3.1 inch x 4.5 inch)

    Weight 2.5 kg (5.6 lb)
    Fittings (on the unit) Carrier Gas Inlet 1/4 in. VCR female split nut
    Liquid Inlet 1/8 in. VCR female
    Vapor Outlet 1/4 in. VCR female split nut
    Compressed Air 4 mm instant tube fitting
    Wetted Parts SS 316, PEEK, PTFE, Elgiloy®, FFKM
    Leak Integrity ≤ 1x 10-8 Pa·m3/s Helium
    Heater Power Requirements1 208 VAC, 60 Hz, 450 W
    Carrier Gas Inert gas recommended
    Max Carrier Gas Flow1 2.0 standard liters/min N2 @ 50 psig
    Max Liquid Flow2 7 g/min (TEOS or equivalent)
    System Pressure Limit 150 psig
    Compressed Air 90 to 110 psig
    Temperature Range3 40°C to 180°C
    Temperature Sensor 2 type Ƙ thermocouples

    Specifications subject to change without notice.

    Max Carrier Flow, Heater Power (W) and Line Voltage are factory adjustable, visit www.tsi.com/contact to request more information.
    Max. liquid flow is process dependent. The spec assumes a vaporizer temperature of 180°C, max. carrier gas flow and pressure <50 Torr immediately downstream of the vaporizer.
    Appropriate venting is required.

  • High-Flow Turbo II Vaporizer 2855NP
    MSP's Turbo II™ Vaporizer 2855NP is designed for applications that require mid to high vapor flow rates....

  • Based off of the field proven, highly reliable, and low-maintenance MSP Turbo™ Vaporizers, the new 2855NP delivers twice the vapor output in a footprint that is half the size. The 2855NP has a liquid shut-off valve, and can be used with any liquid flow controller that has an integrated flow control valve.

    Dimensions (HxWxD)

    249 mm x 79 mm x 142 mm (9.8 inch x 3.1 inch x 5.6 inch )

    Weight 5.1 kg (11.2 lb)
    Fittings (on the unit) Carrier Gas Inlet 1/4 in. VCR female split nut
    Liquid Inlet 1/8 in. VCR female
    Vapor Outlet 1/2 in. VCR female
    Compressed Air 4 mm instant tube fitting
    Wetted Parts SS 316, PEEK, PTFE, Elgiloy®, FFKM
    Leak Integrity ≤ 1x 10-8 Pa·m3/s Helium
    Heater Power Requirements1 208 VAC, 60 Hz, 900 W
    Carrier Gas Inert gas recommended
    Max Carrier Gas Flow1 10 standard liters/min N2 @ 50 psig
    Max Liquid Flow2

    40 g/min (TEOS or equivalent)

    System Pressure Limit 150 psig
    Compressed Air 90 to 110 psig
    Temperature Range3 40°C to 200°C
    Temperature Sensor 2 type Ƙ thermocouples

    Specifications subject to change without notice.

    Max Carrier Flow, Heater Power (W) and Line Voltage are factory adjustable, visit www.tsi.com/contact to request more information
    Max. liquid flow is process dependent. The spec assumes a vaporizer temperature of 200°C, max. carrier gas flow and pressure <50 Torr immediately downstream of the vaporizer.
    Appropriate venting is required.

  • High-Flow Turbo II Vaporizer 2855PE
    MSP's Turbo II™ Vaporizer 2855PE is designed for high-precision microelectronic applications that require mid to high vapor flow rates....

  • Based off of the field proven, highly reliable, and low-maintenance MSP Turbo™ Vaporizers, the new 2855PE delivers twice the vapor output in a footprint that is half the size.

    Dimensions (HxWxD)

    249 mm x 79 mm x 142 mm (9.8 inch x 3.1 inch x 5.6 inch)

    Weight 5.1 kg (11.2 lb)
    Fittings (on the unit) Carrier Gas Inlet 1/4 in. VCR female split nut
    Liquid Inlet 1/8 in. VCR female
    Vapor Outlet 1/4 in. VCR female
    Compressed Air 4 mm instant tube fitting
    Wetted Parts SS 316, PEEK, PTFE, Elgiloy®, FFKM
    Leak Integrity ≤ 1x 10-8 Pa·m3/s Helium
    Heater Power Requirements1 208 VAC, 60 Hz, 900 W
    Carrier Gas Inert gas recommended
    Max Carrier Gas Flow1 10 standard liters/min N2 @ 50 psig
    Max Liquid Flow2 40 g/min (TEOS or equivalent)
    System Pressure Limit 150 psig
    Compressed Air 90 to 110 psig
    Temperature Range3 40°C to 200°C
    Temperature Sensor 2 type K thermocouples

    Specifications subject to change without notice.

    Max Carrier Flow, Heater Power (W) and Line Voltage are factory adjustable, visit www.tsi.com/contact to request more information.
    Max. liquid flow is process dependent. The spec assumes a vaporizer temperature of 200°C, max. carrier gas flow and pressure <50 Torr immediately downstream of the vaporizer..
    Appropriate venting is required.