Your SEMI Partner with Equipment + Process Expertise
ECM GREENTECH is present in the semiconductor market since 1986 and has extensive experience in engineering and manufacturing of mass-production and labortory furnaces for atmospheric and reduced-pressure processing as well as wafer transport automation and software control.
The company's field of competence covers diffusion, oxidation, LPCVD and PECVD. Typical applications include LYDOP POCL3 and BCl3 Diffusion, LYTOX Wet and Dry Oxidation, Anneal, Silicon Nitride, Silicon Oxinitride, Poly Silicon and TEOS. To address the challenges attached to scaling from lab scale R&D to pilot line and volume manufacturing, ECM GT proposes the MINILAB platform, an offsite process development and qualification tool.
An ECM Group company, Annealsys manufactures Rapid Thermal Processing (RTP) and Direct Liquid Injection-chemical vapor deposition (DLI-CVD/ALD) systems. Annealsys provides outstanding technical and process customer service through worldwide sales and service organization.
Our customers are Research and Development laboratories and companies for production applications.
Batch type Tube Furnace
Diffusion, LPCVD and Oxidation
1 to 4 Independent Tubes
Up to 300mm wafers
Up to 50 wafers per tube
Ideal for process engineering
Tiny Footprint
Manual or Automatic Loading
Batch type PECVD System
Direct Plasma, Low RF
Pin Mark Free, Color Uniform
Horizontal Wafer Process
Up to 25 wafers per batch
Multiple layers deposition possibilities
In-situ Cleaning
Batch type production Furnace
Up to 4 Independent Tubes
50 to 400 wafers per tube
Best in-class Uniformity
Automatic Loading
High temperature infrared heating
Si, SiC, GaN, Sapphire wafers
Wafers up to 300mm
Up to 1200°C
Single or dual chambers
Cassette to cassette automation
SiC wafers oxidation
Dry & wet oxidation
High temperature resistive heating
Up to 1600°C
Up to 50 wafers 200mm
Automatic loading
SiC, GaN wafers annealing
Graphene growth
Fast heating and cooling capability,
Up to 2000°C