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TECHNIC KOREA

Seoul,  Korea (South)
http://www.technic.com
  • Booth: B226

TECHNIC Advanced Engineered solutions for the electronics

Overview

A Global Leader in:

  Specialty Chemicals

  Surface Finishing Equipment

  Engineered Powders

  Analytical Controls


Technic offers a full range of chemistry for advanced semiconductor packaging.

Marketed under the name Elevate, Technic’s electrodeposition chemistries are well

respected for innovation and high-quality in such applications as RDL, pillars, microbumps,

and LED packaging. Technic also supplies several high-performance photoresist strippers

for liquid and dryfilm resists, as well as a full range of metal etchants and cleaners marketed

under the names, TechniStrip®, TechniEtch, and Techniclean.

  • TechniClean: PER removers, PCMP Cleaning, ink remover, debonding, etc.
  • TechniStrip®: Liquid resist and laminated film strippers
  • TechniEtch: Selective barrier, seed layer, stack etchants

Technic offers a wide range of electroplating products for semiconductor applications, including:

Cu, Ni, Sn, Au, Au/Sn, In, commercialized under the Elevate®


  Products

  • Elevate® Gold 7990 NBV HT
    Stable, Environmentally Friendly, and Versatile Elevate Gold 7990 NBV HT eliminates the inherent weaknesses of traditional sulfite gold processes. Because Elevate Gold 7990 NBV HT operates at a pH of 6.3, it is compatible with all photoresists....

  • Features

    • Very stable electrolyte
    • Low-stress deposit
    • Smooth, bright deposit without the use of harmful metallic grain refiners
    • Low deposit thickness variation across the wafer even with small and large features on the same die
    • Able to deposit 2 – 3 times more gold in vias compared to a standard sulfite gold process
    • Extended bath life of 4 – 5 metal turnovers in most applications
    • Currently in production around the world in high volume manufacturing

    Benefits

    Reduced cost of operation through:

    • Extended bath life which significantly reduces the number of bath makeups per year
    • Stable electrolyte eliminates scrap produced from bath plate-out
    • Excellent coplanarity and step coverage resulting in less gold used per wafer
    • High-speed plating increases wafer production capabilities
    • Free of cyanide, thallium, and arsenic making it safe for operators and environmentally responsible.
    • For use in plating tools from manual wet bench and R&D to fully automatic production lines.
    • One of the most widely used and reliable sulfite gold chemistry in the semiconductor industry.
  • TechniEtch TBR19
    High-Performance Etchant TechniEtch TBR19 is a stabilized hydrogen peroxide based metal etchant that is extremely selective with a very low undercut value of < 0.2 microns...

  • Features

    • Excellent selectivity
    • Low undercut
    • Improved etch uniformity
    • Stable and consistent etch rate over the life of the bath
    • Fluoride-free aqueous solution
    • Compatible with most UBM and copper pillar integration materials
    • Fully compatible with aluminum
    • Tunable etch rate


    Benefits

    • High selectivity and low undercut provides high yields with fine pitch patterns
    • Reduced cost of operation through extended bath life
    • High process efficiency through stable chemistry and consistent etch rate
    • Wide process operating window – 50% process overetch still results in minimal undercut
  • TechniStrip® NF52
    TechniStrip® NF52 is formulated to provide powerful stripping performance on difficult to remove dryfilm photoresist and is the product of choice for many leading semiconductor manufacturers....

  • High Dissolution, High Metal Compatibility NMP-Free Photoresist Stripper

    Features

    • Dissolution on most commercial dryfilm photoresist • Dissolution of commercial spin-on photoresist (N & P Tones)
    • Extremely low etch rate on Cu, Ni, Au and other materials • Compatible with fragile III/V materials and organic substrates
    • High stripping rate of > 10 µm/minute
    • Long bath life
    • Proven performance on both batch (spray and immersion) and single-wafer toolsets

    Benefits

    • Reduced cost of operation achieved through a highly efficient process and longer bath life
    • Reduced defects by providing full dissolution on most dryfilm and liquid photoresist
    • High metal compatibility provides wider processing window and ease of operation
    • CMR free (carcinogenic, mutagenic or toxic for reproduction) formulation reduces safety risk to operators
  • TechniClean CA25
    PER Remover...

  • Post Etch Residue remover that has been designed to provide an optimum balance of surface wetting, reduced potential, chelat-ing capacity and residue solubility to accomplish complete PER dissolution at a low temperature and short processing time for various electronic features such as lines, vias and pads.

  • RTA 3D
    Real Time Analyzer 3D...

  • Technic’s Real Time Analyzer 3D version is the culmination of many years of field and lab experience by the RTA team. This system utilizes all the technology found in the well-established RTA system with additional features to increase reliability and robustness. The Technic RTA is the only commercially available automatic instrument that utilizes a combination of modern electrochemical techniques (Cyclic Voltammetry including) with state-of-the-art statistical (chemometric) approach.

    Features and Benefits
    • State-of-the-art of electronic components
    • Innovative electrochemical techniques
    • Intuitive Graphical User Interface
    • Design based on field experience and customer input
    • Virtually consumable free
    • Automatic temperature correction capabilities
    • Open software architecture allowing advanced for customization and integration