APS GROUP

Hwaseong-si, Gyeonggi-do,  Korea (South)
https://apsinc.co.kr/
  • Booth: A404

Categories

200 Equipment, Assembly
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Dispensing Systems
  • Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment
  • Wafer Level Bonders
    • 203 Equipment, Inspection & Measurement
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
    • 204 Equipment, Mems
  • Deep RIE etching; Dry Etching
  • Wafer Level Bonders
    • 207 Equipment, Process
  • Coat; Develop; Resist Processing; Track Equipment
  • Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
  • Etching; Stripping; Ashing - Dry and Wet Equipment
  • Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment
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