FST Scrubber aims to remove unwanted, harmful gases generated from semiconductor and display manufacturing processes.
Also, scrubber promises not only a high capability in processing, but also the cost-efficient and easy maintenance through optimized system by processing capacity.
Scrubber exists in various types, such as absorbent, Plasma, Burn, Heat, Wet, depending on the process conditions.
Product Line Up:
▣ Plasma Wet
- Capacity: 600slm, Inlet Port: 4/6 Port
- Process application: All processes including PFCs Gas
- Key feature: Toxic/acidic gas decomposition using ultra-high temperature “10,000K” Plasma Arc
- Safety: Automation system through PLC Control, Auto By-pass function, Fire detecting through smoke detecting, external cooling of the chamber using PCW, Water leak detection function
▣ Burn Wet
- Capacity: 600slm, Inlet Port: 4/6 Port
- Process application: Some PFCs gas can be removed (NF3), CVD, Diffusion, etc.
- Key feature: Toxic/acidic gas decomposition using high teat and strong energy through LNG(CH4)
- Safety: Automation system through PLC Control, Auto By-pass function, Fire detecting through smoke detecting, external cooling of the chamber using PCW, Water leak detection function, LNG(CH4) detection function
▣ Heat Wet
- Capacity: 600slm, Inlet Port: 4/6 Port
- Process application: CVD, LPVD, Diffusion. etc.
- Key feature: Gas removal through thermal decomposition and oxidation a high-temperature heater
- Safety: Powder control function, automation system through PLC Control, Auto By-pass function, External cooling of the chamber using PCW, Water leak detection function
▣ DRY
- Capacity: 100,200, 5000slm, Inlet Port: 1 Port
- Process application: Ion implantation, Plasma Etch, ALD, CVD, MOCVD
- Key feature: Toxic gas removal based on physicochemical reaction (With in TLV), Core technology of DRY SCR = “Resin”
- Safety: Powder control function, Automation system through PLC control, Auto By-pass function