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FST (Fine Semitech Corp.)

Hwaseong-si,,  Gyeonggi-do 
Korea (South)
http://www.fstc.co.kr/eng/
  • Booth: DS20

Welcome to visit our site and we appreciate!

Overview

We will lead the global market with innovative technologies and distinguished quality competitiveness. 

Since its establishment in 1987, FST has been committed to supplying high quality products to high-end semiconductors and FPD industries. We have achieved continuous growth in the pellicle business, one of the main materials used in the semiconductor and FPD manufacturing process, and the chiller, which controls the temperature and humidity of various equipment. FST has also innovated self-developed optical inspection systems to secure competitiveness in newly developed products related to semiconducting.

For the last 31 years, FST has made every effort to meet customers’ expectations and striven to advance its technologies. Our focus is to be the most competitive supplier in the global market with our distinguished and uncompromising quality and services.

FST will always do its very best to improve the value of our products and services for our customers’ satisfaction.

Thank you.


  Products

  • Pellicle
    A pellicle is a thin membrane stretched over an aluminum frame and glued to the photomask to protect it from contaminants, such as particles....

  • Definition & Usage

    A pellicle is a thin membrane stretched over an aluminum frame and glued to the photomask to protect it from contaminants, such as particles. Even if particles sit on the membrane, they are not printed on the wafer because they are out of focus during the exposure from the lithography process. 

    Purpose of Use

    • To improve the yield rate of IC chips

    • To extend the cleaning period of the photomask

    • To protect the photomasks from contamination

    • To extend the lifetime of the photomask

    • To isolate sources of contamination

  • Chiller
    The Chiller of FST is an equipment that improves process efficiencies by constantly maintaining inside-chamber wafer and its surrounding temperatures, through the excessive heat produced in semiconductor etching process....

  • The Chiller of FST is an equipment that improves process efficiencies by constantly maintaining inside-chamber wafer and its surrounding temperatures, through the excessive heat produced in semiconductor etching process. As the process becomes more micro and solid, continuous development of Chiller is requested for more customized equipment supply. Accordingly, products of various fundamental technology and design technology basis are being manufactured.

    • Thermoelectric Chiller

      • Momentary Power Outage Resistance (Power Vaccine) 

      • High Efficiency(Hiper) TEM & Block 

      • Compact Size & User-friendly Structure 

      • High Accuracy & Fast Response Temperature Control (±0.01℃) 

      • IGBT Circuit, Non-defective SMPS 

    • Compressor-type Chiller

      • High-reliability Refrigeration Components and Cycle 

      • Low Noise, Low Power Circulation System (50% Reduction) 

      • Momentary Power Outage Resistance (Power Vaccine) 

      • Energy-saving Refrigeration System (60% less power) 

      • Seismic & Vibration-resistance Design 

    • Heat Exchanger

      • High-reliability Components and Sensors 

      • Low Noise, Low Power Circulation System (50% Reduction) 

      • Momentary Power Outage Resistance (Power Vaccine) 

      • Precision Control 3-Way Valve (±0.01℃) 

      • Seismic & Vibration-resistance Design 

    • Cryogenic Chiller

      • High-reliability System under Cryogenic Condition (Dew condensation, Freezing Prevention) 

      • Rapid Cooling and Maintaining (20 ▶ -80℃, 10min.) 

      • Momentary Power Outage Resistance (Power Vaccine) 

      • Special Refrigeration System Extra Low Temperature (7kW@-70℃) 

      • Seismic & Vibration-resistance Design 

    • THC (Temp & Humidity Controller)

      • Energy Saving Refrigeration System (60% Reduction) 

      • Temperature / Humidity Stability (±0.01℃ / ±0.2%)        

      •  Momentary Power Outage Resistance (Power Vaccine) 

      • DI Supply Stabilization System 

      • Seismic & Vibration-resistance Design 

  • Scrubber
    Air pollution control device that is used for purification in semiconductor and display processes...

  • FST Scrubber aims to remove unwanted, harmful gases generated from semiconductor and display manufacturing processes.

    Also, scrubber promises not only a high capability in processing, but also the cost-efficient and easy maintenance through optimized system by processing capacity.

    Scrubber exists in various types, such as absorbent, Plasma, Burn, Heat, Wet, depending on the process conditions.

    Product Line Up:

    ▣ Plasma Wet

    - Capacity: 600slm, Inlet Port: 4/6 Port

    - Process application: All processes including PFCs Gas

    - Key feature: Toxic/acidic gas decomposition using ultra-high temperature “10,000K” Plasma Arc

    - Safety: Automation system through PLC Control, Auto By-pass function, Fire detecting through smoke detecting, external cooling of the chamber using PCW, Water leak detection function

    ▣ Burn Wet

    - Capacity: 600slm, Inlet Port: 4/6 Port

    - Process application: Some PFCs gas can be removed (NF3), CVD, Diffusion, etc.

    - Key feature: Toxic/acidic gas decomposition using high teat and strong energy through LNG(CH4)

    - Safety: Automation system through PLC Control, Auto By-pass function, Fire detecting through smoke detecting, external cooling of the chamber using PCW, Water leak detection function, LNG(CH4) detection function

    ▣ Heat Wet

    - Capacity: 600slm, Inlet Port: 4/6 Port

    - Process application: CVD, LPVD, Diffusion. etc.

    - Key feature: Gas removal through thermal decomposition and oxidation a high-temperature heater

    - Safety: Powder control function, automation system through PLC Control, Auto By-pass function, External cooling of the chamber using PCW, Water leak detection function

    ▣ DRY

    - Capacity: 100,200, 5000slm, Inlet Port: 1 Port

    - Process application: Ion implantation, Plasma Etch, ALD, CVD, MOCVD

    - Key feature: Toxic gas removal based on physicochemical reaction (With in TLV), Core technology of DRY SCR = “Resin”

    - Safety: Powder control function, Automation system through PLC control, Auto By-pass function

     

     

  • EUV Infra Tool
    EUV Pellicle Mount/Demount (EPMD) EUV Pellicle Inspection Sytem (EPIS) EUV Pod Inspection System (EPODIS) EUV Source...

  • EUV Pellicle Mount/Demount (EPMD)

    • Application

      • Fully Automated EUV Pellicle Mounting & Demounting

    • Key Features

      • High throughput

      • Automation

        • EUV mask auto track in/out by supporting OHT (OHT: Overhead Hoist Transport)

        • EUV pellicle stock & retrieve (Auto EUV pellicle case open with unclipping)

      • Precise process control

        • Glue dispensing control: shape & volume monitoring

        • Fine heat-temperature control: stud fixation & removal process

        • Various vision monitoring tools: preventing pellicle breakage during mounting & demounting process

    EUV Pellicle Inspection System (EPIS)

    • Application

      • EUV Pellicle & Pelliclized EUV Mask Inspection

    • Key Features

      • 1um PSL equivalent particle inspection

      • Inspection Throughput: 15mins/pellicle, 16mins/pelliclized EUV Mask Automation

    • Automation

      • EUV mask auto track in/out by supporting OHT (OHT: Overhead Hoist Transport)

      • EUV pellicle stock & retrieve (Auto EUV pellicle case open with unclipping)

      • Automatic defect review

      • Automatic defect classification on pellicle membrane (front side, back side, hole)

      • Support various application of inspection for EUV Pellicle and/or pelliclized  EUV Mask

        • Incoming EUV Pellicle quality control: Inspection defectivity & mechanical strength)

        • Pellicle status monitoring: Membrane stability after certain number of shots by scanner

        • Mask exterior inspection: backside, edge & etc.

    EUV Pod Inspection System (EPODIS)

    • Application

      • ​Inspection and measurement of EUV inner PODs​

    • Key Features

      • Inspection of various areas

        • Diverse altitude, mask support pin, square/round holes, inner wall Identify incompletely plated area

      • Mesurement

        • POD's parallelism & pitch between support pins

      • Addtional Functions

        • Removal of particles (N2 blowing & suction)

        • POD stocking 

        • POD’s status monitoring

    EUV Source 

    • EUVO TM (Extreme Ultra Violet Oscillator) is based on High-order Harmonic Generation driven by ultra-fast laser. The system has excellent coherence, low divergence, tunable wavelength, and table-top size footprint.
      It is compact, easy to use, reliable, and cost effective EUV light sources. It is uniquely suited for Infrastructure of EUV Lithography and its applications.

    • High-order Harmonic Generation driven by ultra-fast laser

      • Excellent coherence

      • Low divergence

      • Table-top size footprint

      • Tunable wavelength

    • Application

      • Mask defect review system

      • EUV transmittance/reflectance measurement system

      • EUV interferometer

      • Coherent scattering microscopy

  • DUV Solutions
    Optical Pellicel & Mask Inspection system (MERCURY) ArF, KrF Pellicle Inspection System (PRIME Series)...

  • MERCURY System is designed for accurate and high-throughput defect measurement on optical pellicle and photomask.It can be used for incoming quality check (IQC) and outgoing quality check (OQC) during production.

    • MERCURY (Optical Pellicle & Mask Inspection System)

      • Low cost of ownership (minimized consumable parts)

      • Pellicle/ mask inspection (mask chamfer and side)

      • User-friendly recipe creation

      • A.D.R (Automatic Defect Review) 

      • Automatic review function

      • Discern whether particle is located front/back side of the membrane