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Genesem Inc.
Incheon,
Korea
Korea (South)
http://www.genesem.com
Booth: C536
Categories
200 Equipment, Assembly
Ball Placement; Attach Systems
Cleaning; Washing Equipment for Assembly & Packaging
Cut & Down Set; Trim; Form Equipment
Die Bonding; Attach Equipment
Die Sorter; Pick & Place; Flip Chip Placement Systems
Dispensing Systems
Lead Frame Taping Systems
Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
Marking; Imprinting; Labeling Equipment
Molding; Encapsulation; Decapsulation Equipment
Package Handling; Conveying Equipment
202 Equipment, General Use
Lamination; Sheet Laminating Equipment
206 PV Equipment
Cells
Modules
Wafers
207 Equipment, Process
Bumping Systems
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Appointment Date*
Wednesday, Jan 31 2024
Thursday, Feb 01 2024
Friday, Feb 02 2024
Start Time*
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PM
End Time*
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Wed Jan, 31
Thu Feb, 01
Fri Feb, 02
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