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APS GROUP
Hwaseong-si, Gyeonggi-do,
Korea (South)
https://apsinc.co.kr/
Booth: A404
Categories
200 Equipment, Assembly
Cleaning; Washing Equipment for Assembly & Packaging
Dispensing Systems
Tape Automated Bonding (TAB); Bumped Tape Automated Bonding (BTAB) Equipment
Wafer Level Bonders
203 Equipment, Inspection & Measurement
Defect; Particle; Bump; Contamination Detection, Review or Inspection
204 Equipment, Mems
Deep RIE etching; Dry Etching
Wafer Level Bonders
207 Equipment, Process
Coat; Develop; Resist Processing; Track Equipment
Deposition; Chemical Vapor (CVD); MOCVD; PECVD; LPCVD; ALD; REALD; MVD
Etching; Stripping; Ashing - Dry and Wet Equipment
Thermal Processing - Diffusion; Oxidation; Annealing; RTA; RTP Equipment
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Appointment Date*
Wednesday, Jan 31 2024
Thursday, Feb 01 2024
Friday, Feb 02 2024
Start Time*
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End Time*
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Wed Jan, 31
Thu Feb, 01
Fri Feb, 02
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