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RPS CO., LTD.

Daejeon,  Korea (South)
http://www.rps-korea.com
  • Booth: A162

Welcome to RPS, a leader in high precision machining.

Overview

RPS Co., Ltd. which has the best technology and the biggest production capacity in the field of Air & Ball Bearing Spindles and Ceramic Vacuum Chuck Table in the domestic market keeps growing on the basis of technological capability proven by companies which lead the conductor and display market of the world and experiences accumulated in the industry over the years.

Since its establishment, management and staffs of RPS Co. have united and done their utmost to maximize company value with quality and technologies under our managemnet principles of "Change and innovative management, successful management and management with which everybody is satisfied." As a result of such efforts, RPS Co. has opened the door to advancing into the global market.

We will build our position firmly in the center of the market for Super precision machining spindle which is changing rapidly and are committed to being reborn as a world class company by maximizing our core capabilities in each business area.


  Products

  • Ultrasonic CNC Drilling Machine
    RUV-400S The world's first air bearing ultrasonic spindle applied to drilling equipment...

  • The world's first Air Bearing Ultrasonic Spindle (HSK-E25).

    Using a mineral casting frame, there is little thermal deformation and excellent high rigidity, low vibration and vibration absorption effects.

    Roller Retainer Type is applied to the Z-axis LM Guide to enable smooth repetitive motion with high rigidity and low friction.

    Using a linear servo motor, axis transfer is possible with low friction and no vibration.

    Spindle and equipment status can be diagnosed using smart system (option)

    Application:

    Si 10~26T various thickness processing possible (various micro drill processing such as Ø0.35~Ø0.75 based on mass production)

    Capable of processing various difficult-to-cut materials such as SiC, Y2O3, ZrO2, Photoveel2, Quartz, AlN and etc,.

  • Air bearing spindles
    Air bearing spindle for ultra-precision processing such as semiconductor wafer dicing, Si electrode drilling, and display edge grinding....

  • RPS's air bearing spindle is suitable for ultra-precision machining applications due to its low vibration and low noise characteristics.
    We are specialized in air bearing spindles of various specifications with extensive mass production experience in the fields of semiconductor wafer and package dicing, display edge grinding, and micro drilling.
  • Ball bearing spindles
    Ball bearing spindle for precision processing in the semiconductor field...

  • RPS supplies a variety of products, including spindles for processing semiconductor materials such as quartz, sapphire, and Si, as well as mold grinding.
  • Air cylinder
    Air cylinder for semiconductor package equipment such as Flip chip mounter, Die bonder and TC bonder equipment...

  • This is a cylinder product that uses air bearings to levitate the shaft using compressed air. It enables fast response speed and high-precision control, and is also capable of air blower and air suction.

    It is generally used in manufacturing and inspection processes such as [Semiconductor Flipchip Mounter / Die Bonder /TC Bonder, wafer, PCB, Glass].

    We can develop and supply customized products according to various customer requirements, and quality items are managed through consultation with customers.

  • Smart System [V-Plus4.0]
    Condition diagnosis system through accurate vibration analysis of rotating bodies...

  • Implementation of status diagnosis and predictive maintenance through accurate analysis of the status of various rotating bodies such as motors, bearings, spindles, and turbines using dedicated acceleration sensors.

    1. When trigger signal is applied
    2. Acquisition of sensor data from a total of 6 channels
    3. V-Plus 4.0 data analysis and status diagnosis
    4. User system and I/O linkage

  • Porous vacuum chuck
    Porous vacuum adsorption of semiconductor wafers and PCBs...

  • This is a part that fixes the object by optimizing full or partial adsorption through vacuum when processing, cleaning and transporting Si wafer, PCB, Glass, OLED and Film using porous ceramic.


    RPS porous vacuum chuck features:

    Excellent durability
    Excellent flatness
    Anti-static function
    price competitiveness