SCREEN Semiconductor Solutions have been developing single-wafer cleaning equipment since 1983. Since then, we have long evolved the technology by pursuing optimal treatment of the air-liquid interface on wafer surfaces. The SU-3400 inherits the stable cleaning performance of the industry-leading "SU Series" and is at the forefront of productivity and processing performance.

Features
 

1. Throughput of up to 1,200 wph

Superior cleaning and processing capacity approaching that of batch-type cleaner equipment. By improving the configuration and layout of the wafer transport robots and the wafer processing chambers, we have achieved a processing capacity of 1,200 wafers per hour, leading the world in the field of single-wafer cleaning equipment.

2. Footprint reduced by 30%

Achieved a 30% footprint reduction by downsizing the 24 cleaning processing chambers of the SU-3300 and upgrading to a six-tiered tower structure.

3. Reduction of environmental load (Exhaust/Nitrogen/Chemical)

The equipment’s environmental impact has been reduced by 20% by minimizing exhaust amount by fully automating the airflow and significantly reducing chemical use by improving the cleaning nozzle and chemical circulation system.

4. Stable operation using Big Data and malfunction prevention through camera surveillance

High-resolution chamber video monitoring is available, as well as a full range of support and maintenance functions, such as malfunction detection using IoT and big data.

1. High productivity

In an industry-first1 for a scrubber type system, the SS-3300S is equipped with a new platform enabling installation of up to 16 chambers. A new dual transport system dramatically improves production volume for the system’s footprint, helping the SS-3300S achieve the industry’s highest practical throughput of up to 1,000 WPH2.

2. Space-saving design

The SS-3300S has a footprint 27% smaller than two 8-chamber SS-3200 spin scrubbers, saving space and delivering exceptional cost performance.

3. Control system revamped

The redesigned control system means the SS-3300S is ready for IoT and inter-system connection, adaptable for the current transition to smart factories.

4. Emissions reduction solution (optional)

An optional exhaust recirculation system reduces total emissions by 65%, ensuring clean equipment operation to support ESG measures.

1. Based on SCREEN in-house research (as of December 2020)
2. Peak throughput during continuous operation running with the same flow recipe

Contributing to the device industry through high productivity, a small footprint, improved ease of maintenance and operability plus eco-friendly processing to support GX.

These systems inherit a wealth of advanced coat/develop track technologies refined by SCREEN SPE over many years and deliver both outstanding productivity and a smaller footprint. They are also distinctly more environmentally friendly, dramatically reducing resist consumption during wafer coating and electricity consumption throughout the manufacturing process.

FEATURES

1. Expandability and flexibility to handle both legacy processes and DUV processes

Dedicated design for 200mm wafers enables a small footprint and DUV process. It is compatible with both the replacement of existing equipment and installation in new plants.

2. 300 mm unit technology is redeployed in a new 150–200 mm dedicated platform system

This platform is newly designed exclusively for 200mm, inheriting the multilevel configuration technology cultivated in the existing system for 300mm. In addition, it delivers a small footprint and high productivity using unit processing technologies for cutting-edge devices, such as reducing chemical consumption, particles, defects, and downtime due to improved maintainability.

1. High Throughput

The FC-3100 is capable of achieving a high throughput of 1,000 wafers per hour, which has been realized by incorporating a high throughput buffer module and a high-speed transfer module.

2. Stable and Highly Reliable

Seven independent modules can be easily configured to best suit your production needs. Each module is of standardized construction. Dual cleaning baths are built into a single compact module for smoother assembly, adjustment, testing and installation.

3. Low Pressure Drying System (HiLPD)

Provided with the HiLPD, a low pressure drying system, the FC-3100 is able to provide high concentration IPA vapor without using carrier N2 gas to greatly suppress watermark generation. In addition, the high concentration IPA vapor rapidly reduces surface tension preventing pattern collapse.

1. Controls heating temperature profiles by the millisecond

The LA-3100 precisely controls the thermal dosage profile of several milliseconds from a xenon flash lamp, which heats the wafer instantly using flash of light.
The wafer surface temperature can be lowered or raised at mid- to high speed, making heat processing with a low thermal budget a reality.
This in turn allows for a high level of activation for the dopant injected into the source/drain, along with precise control of the concentration profile.

2. Low oxygen atmosphere

Single wafer processing makes it possible to anneal in a strictly-controlled low oxygen atmosphere.

3. Functionality for measuring wafer temperature during heat irradiation

The LA-3100 features new functionality for precisely controlling the heat treatment of the entire wafer surface in milliseconds, while measuring the wafer temperature during heat irradiation. This makes it easy to understand and solve physical phenomena with a focus on temperature control, starting with the R&D stage.

1. Approximately Double the Throughput of the Previous Model

Equipped with a proprietary inspection head and a newly developed high-speed image processing engine, we have achieved a processing capacity approximately double* that of the previous model. With the integration of the full-surface inspection system using a line sensor, analyses are performed at a constant speed regardless of chip size or quantity, contributing enormously to stable production.
*Compared with the ZI-3500 model

2. Capable of Detecting and Analyzing Microscopic Defects of 1μm or less

The new objective lens identifies and analyses micro defects of 1μm or less. Equipped with three objective lenses of different resolutions, the ZI-3600 seamlessly handles automated lens switches during inspections. This single system achieves a broad range of defect inspections from micro to macro defects.

3. Easily Create Recipes while Checking the Actual Wafer Image.

Inspection conditions can be set with ease while checking the actual wafer images, enabling expert engineers as well as general operators to create recipes. Additional installation of critical dimension and overlay measurement functions are available. These measurements can be performed simultaneously during inspection simply by setting the conditions when constructing a recipe.