Develop the chips of the future with SET Flip-Chip Bonders.
Overview
Founded in 1975, based in France, SET is a world leading supplier of high accuracy Flip-Chip Bonders and versatile NanoImprint Lithography solutions.
With equipment installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its Flip-Chip Bonders.
Chip-to-chip or chip-to-wafer, from manual loading to fully automated version, they adapt to all main bonding techniques.
SET also offers a global network of representatives -such as Woowon Technology in South Korea- and in-depth customer trainings.