Oxford Instruments

The alpha300 Semiconductor Edition is a high-end confocal Raman and photoluminescence (PL) microscope specifically configured for the chemical imaging of semiconducting materials. It helps researchers accelerate the characterization of crystal quality, strain and doping in their semiconductor samples and wafers.

The microscope’s extended-range scanning stage enables the inspection of up to 12 inch (300 mm) wafers and the acquisition of large-area Raman images. It is equipped with vibration damping and active focus stabilization to compensate for topographic variation during measurements over large areas or long acquisition times. All microscope components are fully automated, permitting remote-control and the implementation of standard measurement procedures.

Benefits

• Full inspection of up to 300 mm (12 inch) wafers
• Non-destructive characterization of crystallinity, polymorphism, defects, strain and doping
• Analysis of wide-bandgap semiconductors and layered structures
• Surface analyses, depth scans and 3D imaging

Key features

• Industry-leading confocal Raman and PL microscope for high speed, sensitivity and resolution – simultaneously
• Scientific-grade, wavelength-optimized spectrometer for high signal sensitivity and spectral resolution
• Large-area scanning (300 x 350 mm) for wafer inspection
• Active focus stabilization for large-area measurements (TrueSurface)
• Vibration damping
• Extensive automation for remote-control and recurring measurement workflows
• Software for advanced data post-processing

The Jupiter XR Atomic Force Microscope is the first and only large-sample AFM to offer both high-speed imaging and extended range in a single scanner. Jupiter provides complete 200 mm sample access and delivers higher resolution, faster results, a simpler user experience, and the versatility to excel in both academic research and industrial R&D laboratories.

• Higher resolution than any other large-sample AFM

• Extended range 100 μm scanner is 5-20× faster than most other AFMs

• From setup to results, every step is simpler and faster

• Modular design adapts to your needs for maximum flexibility

Highest Performance

• Higher resolution than any other large-sample AFM
• Extended-range scanner is 5-20× faster than most AFMs and features large 100 μm X-Y & 12 μm Z range
• Exclusive blueDrive™ Tapping Mode gives more reproducible results and simplifies operation

Simpler User Experience

• Fully-motorized laser and detector setup eliminates manual adjustment of knobs
• Fully-addressable, high-speed stage rapidly reaches any point on 200 mm samples
• Sharp top-view optics help you easily locate your precise region of interest
• Go from atoms to large 100-μm scans and use any imaging mode, all with the single XR scanner

Versatility for Diverse Research Needs

• Support for a full range of imaging modes
• Modular design makes it fast and simple to add accessories and future upgrades
• Flexible software makes routine measurements easy while enabling advanced research
• AR Maps - comprehensive analysis software for all types of AFM data

Support that goes above and beyond your expectations

• Includes a standard one-year comprehensive warranty
• No-charge technical support and basic applications support for life
• Affordable support agreements that offer extended warranties and advanced training

Oxford Instruments’ PlasmaPro 100 Atomic Layer Etch (ALE) solution delivers precise etching control for cutting-edge specifications and performance requirements of GaN HEMTs manufacturers. With a fully-integrated Etchpoint® etch depth monitoring solution optimised for GaN and AlGaN layers, the PlasmaPro 100 ALE system combined provides low damage etching with surface smoothing with unparalleled accuracy in target etch depth for devices such as p-GaN HEMTs and recessed gate MISHEMTs.

The fabrication of GaN HEMTs for power electronics and RF applications is experiencing a massive production ramp driven by the need for efficient, high-performance devices for integration in a wide range of products such as mobile device chargers, electric vehicles, base station transceivers, and data centers.

Key Benefits of PlasmaPro 100 ALE and Etchpoint solution

• High rate ICP and low damage ALE processing of GaN and AlGaN in the same chamber up to 200 mm
• Excellent process etch uniformity for improved device and wafer yield
• Production-proven etching platform trusted for high-volume manufacturing with automated cassette handler
• Patent-pending UV wavelength Etchpoint etch depth monitor developed with LayTec and optimised specifically for GaN and AlGaN etching
• Exceptional post-etch remaining AlGaN thickness accuracy of ±0.5 nm enabled by Etchpoint endpoint detection
• Reduced AlGaN and GaN surface roughness with ALE processing for improved GaN HEMT performance

Etchpoint Etch Depth Monitor

Etchpoint is a patent-pending UV reflectance-based endpoint technique with the optimised wavelength selected to allow for unrivalled accuracy of etch layer depth for GaN and AlGaN. Other endpoint solutions can typically achieve ±2 nm resolution which limits the capability to reliably fabricate some GaN HEMT device structures. This new etch-depth monitoring solution has been exclusively developed and optimised by Oxford Instruments in collaboration with LayTec. Etchpoint is fully integrated with both the hardware and software of the PlasmaPro 100 ALE system.

Atomfab is the fastest remote plasma production ALD system on the market.

SOLUTIONS FOR YOUR PRODUCTION NEEDS

• Competitive CoO
• Quick, easy maintenance
• Excellent film uniformity
• High material quality
• Low substrate damage
• Faster cycles times, high throughput
• Clusterable and automated wafer handling

PROCESS BENEFITS FOR PASSIVATION OF POWER & RF DEVICES

• Guaranteed processes setup by our engineers
• Lifetime process support for additional/new processes
• Low-damage plasma processing
• High quality deposition with low film contamination
• Low particle levels
• Short plasma exposure times enabling high throughput
• Plasma surface pre-treatments

ADVANTAGES OF PLASMA ALD FOR GaN, POWER & RF DEVICES

• With plasma pre-treatment prior to deposition to enhance interface quality
• Low damage, uniform deposition
• Remote plasma ALD with controlled ion energy from near zero to 30 eV
• ALD passivation, gate dielectric by Al₂O₃ films.

Read more about how ALD can optimize GaN power devices in our white paper.

Ultim® Max ∞ (“Infinity”) SDD detectors unlock the infinite potential of EDS for characterising materials in the SEM. They combine unparalleled accuracy, sensitivity and speed to power AZtec Live software to solve the most complex or difficult analysis challenges.

Infinity means guaranteed performance, tested on installation, beyond the typical specifications of any other detector including the highest sensitivity guaranteed with sensor sizes from 40 mm² up to 170 mm² all offering the exact same analytical performance.

Why Infinity?

Ultim Max Infinity unlocks infinite potential for solving even the most complex micro- and nano-characterisation challenges. Whether your challenge is understanding the smallest nano-structures, measuring phase composition, identifying minor or trace elements, mapping compositional variation, or measuring features as quickly as possible, Infinity provides the right data to allow AZtecLive to give you the right answer.

Infinity represents the current state of the art in EDS detector technology providing levels and performance and capability that are unique, and critical to characterising the infinite range of samples seen in today’s FE- and FIB-SEMs.

✔️ The highest sensitivity guaranteed

Sensor sizes from 40 mm² up to 170 mm² all offering the exact same analytical performance.

✔️ The best nano-characterisation and light element detection

Resolution guaranteed at CKa of 46eV or better at all count rates up to 50,000 cps.

✔️ The most rapid micro-analysis

Resolution guaranteed at MnKa of 127 eV or better at all count rates up to 200,000 cps.

✔️ The most accurate qualitative and quantitative analysis

Unique new Tru-Q® IQ​ spectrum processing. Each detector is characterised on SEM during manufacturing and individually optimised to ensure accurate data processing every time.

✔️ The highest count rate X-ray mapping revealing true element variations in seconds

Infinity pulse processing and pile-up correction combine to identify elements and display real artefact-free element distribution.

Oxford Instruments introduces Unity, a new detector for a revolutionary new imaging technique in the Scanning Electron Microscope (SEM). Unity is the world’s first Backscattered Electron and X-ray (BEX) Imaging detector. It seamlessly combines backscattered electron and X-ray signals to deliver rapid high-definition color images embedded with elemental data as you navigate around your sample.

Based on a revolutionary design, which includes both backscattered electron and X-ray sensors within the same sensor package, Unity is located directly beneath the pole piece and has been engineered to maximize signal collection, ensuring it can be used at normal imaging speed and operating conditions, making imaging elementary.

The high-speed BEX data collection of Unity makes it easier than ever before to image and analyze an entire sample in minutes, changing the way SEM is used.

✔️ Flexible working distance

The novel operating position for the X-ray sensors means consistent chemical data can be acquired across a wide range of Working Distances (WD).

✔️ Topography is no problem

The two Unity X-ray sensors provide data from difficult sample topography such as deep troughs which would normally result in no signal due to shadowing. In addition, the two BSE sensors can be configured to topography mode allowing the resulting images to emphasize sample topography instead of sample atomic variation whenever needed.

✔️ Wide field of view

The Unity sensor head is designed with a large aperture diameter, allowing the microscopist to take full advantage of wide field modes, such as fish-eye, helping deliver whole sample analysis at the macro level and high-resolution imaging.

✔️ Variable pressure mode

Unity is designed to work in variable pressure mode, enabling BEX imaging of non-conductive samples.

✔️ High-performance BSE sensors

Unlike conventional BSE detectors, Unity BSE sensors are custom shaped to maximize signal collection and Peltier cooled for enhanced sensitivity, resulting in a high-performance BSE detector.