KYZEN

Product Detail: MICRONOX MX2708 is formulated for the demanding cleaning challenges presented within leadless devices such as low standoff gaps and fine pitches of Cu Pillar flip chips, 2.5D/3D ICs, SiP and AiP. MX2708 completely removes organic acid residue of all kinds at low, safe operating concentrations all while having no effect on exposed metal and intermetallic alloys including Cu, Al, Sn, Pb, Ni, Ag, and Au finishes. MICRONOX MX2708 most effectively cleans organic acid flux residues at lower concentrations in spray-in-air cleaning systems.

• Effectively Cleans Under Highly Dense Die Without Reacting with Exposed Metals
• SAC, Aluminum and Copper Safe
• Low Surface Tension
• Superior Rinsing Ability

Product Detail: MICRONOX MX2127 is an aqueous, single-phase and well-balanced chemistry designed to remove flux residues from all types of IGBT module devices that utilize copper and nickel DBC as substrates. With well-balanced formula, MX2127 leaves great surface conditions for post wire bond and potting processes after cleaning. It is effective at low temperature, low concentration and easily monitored in in-line SIA cleaning system.​

• Effective on All Types of Flux Residues
• Multi-Metal Safe (Copper, Nickel and Aluminum)
• Low Concentration/Low Temperature Usage
• Easy to Rinse
• Easy Waste Treatment