3D-Micromac AG

The microPRO XS OCF system provides laser annealing with high repeatability and throughput in a versatile system. Combining a solid laser optic module with 3D-Micromac’s modular processing platform, the microPRO XS is ideally suited for ohmic contact formation (OCF) for power devices based on silicon carbide (SiC).

The microPRO XS OCF features a UV-wavelength diode-pumped solid-state (DPSS) laser source with nano-second pulses and spot scanning to process the entire metalized backside of SiC wafers. Sophisticated process routines and an optimized chamber layout reduce particle generation. Individual adjustable laser spot profiles enable the processing of different material compositions.

Benefits

• Best-in-class throughput (up to 22 WPH / 6‘‘ wafers)
• Excellent Rs homogeneity (δ < 1.1%)
• 6‘‘ and 8‘‘ wafer processing without stitching – no need for tool adaption
• Ultra-thin wafer handling available
• Small footprint
• Fully automated beam stabilization

The microVEGA xMR system provides high-throughput laser annealing for monolithic magnetic sensor formation. A highly flexible tool configuration, the microVEGA xMR can accommodate both Giant Magnetoresistance (GMR) and Tunnel Magnetoresistance (TMR) sensors, as well as easily adjust magnetic orientation, sensor position and sensor dimension—making it an ideal solution for magnetic sensor production.

Benefits

• Single platform for both GMR and TMR sensors
• High throughput
• Very high energy homogeneity – resulting in improved sensor quality
• Flexible recipe programming and wide parameter range including pulse energy, sensor dimensions, distance between sensors, magnetic orientation and magnetic flux
• Accommodates wafer sizes up to 300 mm
• Tool accuracy: ± 5 μm
• Accuracy of magnetic field direction (orientation): ± 0.010°
• No consumables or product-specific parts required

The microPREP PRO enables laser-based sample preparation for various specimen preparation applications. It complements existing approaches to sample preparation, such as ion beam processing. Several laser sources are available for installation to enhance the individual preparation process.

microPREP PRO is suited to ablate metals, semiconductors, ceramics, polymers, and compound materials. It creates new vistas for material and process development and failure analysis.

Choose your tool

• The microPREP PRO is your tool for laser-based sample preparation on a micron level. It enables laser-based sample preparation for a variety of specimen preparation applications. 
• The microPREP PRO FEMTO is your tool for laser-based sample preparation – especially when preparing atom probe tips (APT) for further analysis

The microVEGA FC system performs high-throughput laser microprocessing for different applications in the semi-industry. The system combines high-precision processes with high dynamics. Therefore, possible applications include:

• Programming of  digital logic circuits,
• Trimming of  digital potentiometers,
• Repairing semiconductor memory on chips
• Removing of failure microLEDs.

Thanks to its highly flexible tool configuration, the microVEGA FC can accommodate both 200-mm and 300-mm wafers at processing speeds of up to 400 mm/s – making it an ideal production solution in terms of cost, throughput, yield, and sensitivity.