Genesem Inc.

Incheon,  Korea 
Korea (South)
http://www.genesem.com
  • Booth: C556

Categories

200 Equipment, Assembly
  • Ball Placement; Attach Systems
  • Cleaning; Washing Equipment for Assembly & Packaging
  • Cut & Down Set; Trim; Form Equipment
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
  • Dispensing Systems
  • Lead Frame Taping Systems
  • Lithography Systems for Wafer Level Packaging; Bumping; 3D Interconnect Aligners
  • Marking; Imprinting; Labeling Equipment
  • Molding; Encapsulation; Decapsulation Equipment
  • Package Handling; Conveying Equipment
    • 202 Equipment, General Use
  • Lamination; Sheet Laminating Equipment
    • 206 PV Equipment
  • Cells
  • Modules
  • Wafers
    • 207 Equipment, Process
  • Bumping Systems
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