1. CMP (Chemical Mechanical Polishing)
This is a semiconductor process that polishes the wafer using chemical and mechanical measures for flat surface.
2. Wet Cleaning System
The C&C Division supplies cleaning systems embedded with various processes to remove the contaminants on both sides of the 300 m silicon wafer in order to prevent losing the yield and reliability of semiconductor products due to the fine particles, metal impurities, and four chemical materials that attach to the surface during the manufacture process.
3. Ceria Slurry
The Ceria Slurry used for the semiconductor CMP process is the suspension made by mixing 80nm-300nm particles, ultrapure water, and chemicals. It is used to chemically and mechanically polish the film on the surface. Selective polishing is possible according to the type of additive films such as Ceria Slurry.
4. Silica Slurry
This slurry used for the Metal Contact / Plug & Poly stages of the CMP process is a suspension that mixes Collodial Silica and functional chemical with DIW. It is applied to the advanced node application to improve the limitation of existing products and realize the performance demanded by world’s top customers.