In the semiconductor industry, device packaging is critical in playing a key role in determining the performance, size, and reliability of modern devices. As manufacturers strive to meet the demands for smaller, more powerful semiconductors, they face challenges such as intricate integration of components, efficient thermal management, material compatibility, and maintaining electrical integrity at higher frequencies. Park Atomic Force Microscopy solutions address these challenges head-on. With their advanced precision and capability to analyze nanoscale structures, Park AFM tools enable manufacturers to navigate the complexities of advanced device packaging.
Park NX-Hybrid WLI is the first-ever AFM with built-in WLI profilometry for semiconductor and related manufacturing quality assurance, process control for semiconductor front-end, back-end up to advanced packaging, and R&D metrology. It is for those that require high throughput measurements over a large area that can zoom down to nanometer-scale regions with sub-nano resolution and ultra-high accuracy.