The evolution of the world's No. 1 cleaning equipment

FEATURES

• Footprint reduced by 30%
• Reduction of environmental load: Exhaust/Nitrogen/Chemical
• Reliable operation backed by big data and problem prevention through camera surveillance

SCREEN Semiconductor Solutions have been developing single-wafer cleaning equipment since 1983. Since then, we have long evolved the technology by pursuing optimal treatment of the air-liquid interface on wafer surfaces. The SU-3400 inherits the stable cleaning performance of the industry-leading "SU Series" and is at the forefront of productivity and processing performance.

Features
 

1. Throughput of up to 1,200 wph

Superior cleaning and processing capacity approaching that of batch-type cleaner equipment. By improving the configuration and layout of the wafer transport robots and the wafer processing chambers, we have achieved a processing capacity of 1,200 wafers per hour, leading the world in the field of single-wafer cleaning equipment.

2. Footprint reduced by 30%

Achieved a 30% footprint reduction by downsizing the 24 cleaning processing chambers of the SU-3300 and upgrading to a six-tiered tower structure.

3. Reduction of environmental load (Exhaust/Nitrogen/Chemical)

The equipment’s environmental impact has been reduced by 20% by minimizing exhaust amount by fully automating the airflow and significantly reducing chemical use by improving the cleaning nozzle and chemical circulation system.

4. Stable operation using Big Data and malfunction prevention through camera surveillance

High-resolution chamber video monitoring is available, as well as a full range of support and maintenance functions, such as malfunction detection using IoT and big data.

The de facto standard batch-type cleaner that boasts high productivity, stability and reliability

FEATURES

• 7 independent modules enhance system configuration flexibility
• High throughput of up to 1,000 wph
• The HiLPD (low-pressure drying) greatly reduces watermarks and high-concentration IPA vapor prevents pattern collapse

1. High Throughput

The FC-3100 is capable of achieving a high throughput of 1,000 wafers per hour, which has been realized by incorporating a high throughput buffer module and a high-speed transfer module.

2. Stable and Highly Reliable

Seven independent modules can be easily configured to best suit your production needs. Each module is of standardized construction. Dual cleaning baths are built into a single compact module for smoother assembly, adjustment, testing and installation.

3. Low Pressure Drying System (HiLPD)

Provided with the HiLPD, a low pressure drying system, the FC-3100 is able to provide high concentration IPA vapor without using carrier N2 gas to greatly suppress watermark generation. In addition, the high concentration IPA vapor rapidly reduces surface tension preventing pattern collapse.

SSRM - double side cleaning in one chamber Applicable to 300mm scrubber

FEATURES

• Capable of cleaning the frontside and the backside of the wafer continuously in one chamber
• High throughput and zero contamination of the device periphery are achieved due to no cross processing and wafer reversal
• Improved the removal performance of the backside edge

1. High Throughput

The development of an advanced transport system and a proprietary algorithm improves throughput by around two times compared to the conventional SS-3100.
This delivers high throughput of up to 800 wafers per hour.

2. Space-saving Design

As with the SS-3100, the SS-3200 is equipped with up to 8 processing chamber units. High throughput can be attained without increasing the number of processing chamber units, providing a very similar footprint to the conventional system.

3. Installation of the Latest Cleaning Tools Achieves High Cleaning Capacity

The SS-3200 can be equipped with the outstanding cleaning tools developed for conventional systems.
This includes the NanosprayǺ spray cleaning system, which provides damageless cleaning of fine patterns.
These tools contribute significantly to the improvement of yield rates for next-generation semiconductor devices.

4. Improved Cleaning Supporting Next generation Processes

The SS-3200’s cleaning level is improved by the selection of components specially designed for miniaturization and a new production method including comprehensive particle handling measures. This supports the increasingly strict cleaning requirements for next-generation cleaning processes.

Spin scrubber for 200mm wafer boasting throughput of up to 500 wph

FEATURES

• The amount of DI water used in wafer processing has been reduced, helping lower environmental impact
• Spin chambers slide out for easier maintenance

The amount of DI water used in wafer processing has been reduced, helping lower environmental impact

Spin chambers slide out for easier maintenance

The flash lamp annealer significantly contributing to the characteristic advancement of cutting-edge devices

FEATURES

• Fast annealing over a wide temperature range
• Flash annealing and assist heating enable millisecond annealing
• Flexible temperature profile control in sub-millisecond units

1. Controls heating temperature profiles by the millisecond

The LA-3100 precisely controls the thermal dosage profile of several milliseconds from a xenon flash lamp, which heats the wafer instantly using flash of light.
The wafer surface temperature can be lowered or raised at mid- to high speed, making heat processing with a low thermal budget a reality.
This in turn allows for a high level of activation for the dopant injected into the source/drain, along with precise control of the concentration profile.

2. Low oxygen atmosphere

Single wafer processing makes it possible to anneal in a strictly-controlled low oxygen atmosphere.

3. Functionality for measuring wafer temperature during heat irradiation

The LA-3100 features new functionality for precisely controlling the heat treatment of the entire wafer surface in milliseconds, while measuring the wafer temperature during heat irradiation. This makes it easy to understand and solve physical phenomena with a focus on temperature control, starting with the R&D stage.

Coat/develop track equipped with a dual track system for a high throughput of over 450 wph

FEATURES

• High productivity and a compact footprint
• Dual-track system enables non-stop operation
• Supports EUV and immersion multi-patterning

1. High-Throughput while Ensuring High Reliability

Running dual, parallel process lines dramatically improves wafer throughput. Since the load is distributed between two separate lines, the SOKUDO DUO also contributes to higher wafer handling robotics reliability since it enables reduced wafer transfer speeds without compromising wafer throughput.

2. Non-Stop Operation Delivers High Productivity

The dual-flow concept makes it possible to run each wafer process line independently. Maintenance can be performed while the system is running production, greatly reducing system downtime. The overall lithography cell wafer output, productivity is optimized by keeping the coat/develop process running so that expensive photolithography exposure scanner time is not wasted.

3. Small Footprint & Flexible Configuration

The dual process line system is a compact platform design that significantly reduces footprint. Various system configurations can be tailored to match specific coat/develop applications to deliver optimized wafer output for the available clean-room area.

4. Advanced Lithography Technology

With SCREEN’s over 30-year technical know-how, the system supports advanced immersion ArF lithography, EUV, E-Beam and Directed Self-Assembly (DSA) coat / develop / bake track solutions to realize high yield for volume production.